公开(公告)号：US20110259628A1

公开(公告)日：2011-10-27

申请号：US13124694

申请日：2009-08-07

Applicant: Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

Inventor： Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

IPC: H05K1/09 ,  C08G59/02 ,  B32B37/00 ,  C08G59/14

CPC classification number: C08G59/08 ,  C08G59/3218 ,  H05K1/03 ,  H05K1/0326 ,  Y10T156/10 ,  Y10T428/249951

Abstract: Provided is a curable resin composition that exhibits good heat resistance and low thermal expansion, and that realizes good solubility in solvents, a cured product thereof, a printed wiring board including the composition, a novel epoxy resin that imparts these properties, and a process for producing the same. A curable resin composition contains, as essential components, an epoxy resin (A) having, in its molecular structure, a glycidyloxy group and a skeleton in which a naphthalene structure and a cyclohexadienone structure are bonded to each other via methylene group(s); and a curing agent (B).

Abstract translation: 本发明提供一种固化性树脂组合物，它具有良好的耐热性和低热膨胀性，并且在溶剂中具有良好的溶解性，其固化产物，包含该组合物的印刷线路板，赋予这些性能的新型环氧树脂，和 生产相同。 固化性树脂组合物含有作为必要成分的环氧树脂（A），其分子结构中含有萘结构和环己二烯酮结构通过亚甲基彼此键合的缩水甘油氧基和骨架; 和固化剂（B）。

公开(公告)号：US20100056747A1

公开(公告)日：2010-03-04

申请号：US12615459

申请日：2009-11-10

Applicant: Ichirou OGURA ,  Kunihiro MORINAGA ,  Kazuo ARITA ,  Yutaka SATO

Inventor： Ichirou OGURA ,  Kunihiro MORINAGA ,  Kazuo ARITA ,  Yutaka SATO

IPC: C08G59/00

CPC classification number: C08G59/621 ,  C08L63/00 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: The present invention relates to a composition containing as a main component, an epoxy resin which has a structure comprising a polyaryleneoxy structure such as polynaphthylene oxide as a main skeleton, (methyl)glycidyloxy group and aralkyl group being introduced on an aromatic ring of the polyaryleneoxy structure, and which has low viscosity, according to the present invention, there can be provided an epoxy resin composition which can impart remarkably excellent flame retardancy and dielectric characteristics to a cured article and a cured article thereof, an epoxy resin, a phenol resin as an intermediate of the epoxy resin, and a method for producing the epoxy resin.

Abstract translation: 本发明涉及含有作为主要骨架的聚亚芳基氧基结构，（甲基）缩水甘油氧基和芳烷基的环氧树脂作为主要成分的组合物，其导入聚亚芳基氧基的芳香环上 结构，并且具有低粘度，根据本发明，可以提供一种环氧树脂组合物，其可以赋予固化制品及其固化制品，环氧树脂，酚醛树脂以显着优异的阻燃性和介电特性 环氧树脂的中间体，以及环氧树脂的制造方法。

公开(公告)号：US08729192B2

公开(公告)日：2014-05-20

申请号：US12280934

申请日：2006-11-10

Applicant: Kazuo Arita ,  Ichirou Ogura ,  Kunihiro Morinaga

Inventor： Kazuo Arita ,  Ichirou Ogura ,  Kunihiro Morinaga

IPC: C08G65/48 ,  C08L63/00 ,  C08F283/00 ,  C08G59/14 ,  C08G65/38

CPC classification number: C08G59/3218 ,  C08G59/245 ,  C08L63/00

Abstract: The invention provides an epoxy resin composition, a novel epoxy resin, a novel phenol resin and a semiconductor encapsulating material. The cured article of the epoxy resin composition has superior characteristics in flame retardancy, heat-resistant and curing. The epoxy resin composition is a preferable resin composition using in a semiconductor device or a circuit board device, and has the structure in which a naphthalene structure is bonded with an arylene group through an oxygen atom, and the total number of the aromatic nucleus in both the naphthalene structures and the arylenes group is 2-8. The epoxy resin composition essentially includes an epoxy resin (A) having the glycidoxy group as a substituent in the aromatic nucleus and a curing agent (B).

Abstract translation: 本发明提供环氧树脂组合物，新型环氧树脂，新型酚醛树脂和半导体封装材料。 环氧树脂组合物的固化物具有优异的阻燃性，耐热性和固化性。 环氧树脂组合物是在半导体装置或电路基板装置中使用的优选的树脂组合物，具有萘结构通过氧原子与亚芳基键合的结构，并且在两者中的芳香核总数 萘结构和亚芳基为2-8。 环氧树脂组合物基本上包括在芳环中具有缩水甘油氧基作为取代基的环氧树脂（A）和固化剂（B）。

公开(公告)号：US08669333B2

公开(公告)日：2014-03-11

申请号：US13807663

申请日：2011-06-08

Applicant: Kazuo Arita ,  Etsuko Suzuki

Inventor： Kazuo Arita ,  Etsuko Suzuki

IPC: C08F283/10

CPC classification number: C08G65/48 ,  C08G59/08 ,  C08G59/42 ,  C08G59/4223 ,  C08G59/4276 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/08 ,  C08L63/00 ,  C08L67/03 ,  C08L71/08 ,  C09D171/08 ,  H01B3/40 ,  H01B3/421 ,  H05K1/0326 ,  H05K3/323 ,  H05K3/4676 ,  H05K2201/012 ,  Y10T428/31511 ,  Y10T428/31529

Abstract: A thermosetting resin composition contains an active ester resin (A) and an epoxy resin (B) as essential components, the active ester resin (A) having a resin structure which includes a polyaryleneoxy structure (I) and in which aromatic carbon atoms in a plurality of the polyaryleneoxy structures (I) are linked through a structural site (II) represented by a structural formula 1 (wherein Ar represents a phenylene group, a phenylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms, a naphthylene group, or a naphthylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms).

Abstract translation: 作为必要成分的热固性树脂组合物含有活性酯树脂（A）和环氧树脂（B），具有树脂结构的活性酯树脂（A）含有聚亚芳基氧基结构（I），其中芳香族碳原子 多个聚亚芳基氧基结构（I）通过由结构式1表示的结构位点（II）连接（其中Ar表示亚苯基，被1〜3个碳原子数为1〜4的烷基核取代的亚苯基） ，亚萘基或被1〜3个碳原子数为1〜4的烷基核取代的亚萘基）。

公开(公告)号：US08263714B2

公开(公告)日：2012-09-11

申请号：US13157926

申请日：2011-06-10

Applicant: Ichiro Ogura ,  Yoshiyuki Takahashi ,  Kazuo Arita ,  Kunihiro Morinaga ,  Yutaka Satou

Inventor： Ichiro Ogura ,  Yoshiyuki Takahashi ,  Kazuo Arita ,  Kunihiro Morinaga ,  Yutaka Satou

IPC: C08L63/00 ,  C08L61/06 ,  C08G59/00 ,  C08G8/04 ,  C08G14/02 ,  C08G65/38

CPC classification number: C08G8/10 ,  C08G59/621 ,  C08L61/06

Abstract: An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).

Abstract translation: 包含环氧树脂和固化剂作为必要成分的环氧树脂组合物，其中固化剂包含具有含酚羟基的芳族烃基（P）的各结构部分的酚醛树脂，含烷氧基的芳族 烃基（B）和二价芳烷基（X），并且在分子结构中还具有含酚性羟基的芳香族烃基（P）和含有烷氧基的芳香族烃基（B ）通过二价芳烷基（X）与其它含酚羟基的芳香族烃基（P）或含烷氧基的芳香族烃基（B）键合。

公开(公告)号：US07718741B2

公开(公告)日：2010-05-18

申请号：US11908464

申请日：2006-03-16

Applicant: Ichirou Ogura ,  Kunihiro Morinaga ,  Kazuo Arita ,  Yutaka Sato

Inventor： Ichirou Ogura ,  Kunihiro Morinaga ,  Kazuo Arita ,  Yutaka Sato

IPC: C08L63/08 ,  C08G59/00

CPC classification number: C08G59/621 ,  C08L63/00 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: The present invention relates to a composition containing as a main component, an epoxy resin which has a structure comprising a polyaryleneoxy structure such as polynaphthylene oxide as a main skeleton, (methyl)glycidyloxy group and aralkyl group being introduced on an aromatic ring of the polyaryleneoxy structure, and which has low viscosity, according to the present invention, there can be provided an epoxy resin composition which can impart remarkably excellent flame retardancy and dielectric characteristics to a cured article and a cured article thereof, an epoxy resin, a phenol resin as an intermediate of the epoxy resin, and a method for producing the epoxy resin.

Abstract translation: 本发明涉及含有作为主要骨架的聚亚芳基氧基结构，（甲基）缩水甘油氧基和芳烷基的环氧树脂作为主要成分的组合物，其导入聚亚芳基氧基的芳香环上 结构，并且具有低粘度，根据本发明，可以提供一种环氧树脂组合物，其可以赋予固化制品及其固化制品，环氧树脂，酚醛树脂以显着优异的阻燃性和介电特性 环氧树脂的中间体，以及环氧树脂的制造方法。

公开(公告)号：US20120308832A1

公开(公告)日：2012-12-06

申请号：US13577235

申请日：2011-01-19

Applicant: Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

Inventor： Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

IPC: C08G8/28 ,  B32B27/38 ,  C08G59/14

CPC classification number: H05K1/0326 ,  C08G8/08 ,  C08G8/12 ,  C08K5/13 ,  H05K2201/012 ,  Y10T428/31515 ,  C08L61/06

Abstract: A phenol resin composition used as a curing agent for an epoxy resin includes a naphthol novolac resin (a1) represented by general formula (1) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeating unit and an integer of 1 or more), and a compound (a2) represented by general formula (2) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group), wherein the total ratio of compounds with n=1 and n=2 in the general formula (1) present in the composition is in the range of 10 to 35%, the average of n in the general formula (1) is in the range of 3.0 to 7.0, and the content of the compound (a2) in the composition is 1 to 6%.

Abstract translation: 用作环氧树脂固化剂的酚醛树脂组合物包括由通式（1）表示的萘酚酚醛清漆树脂（a1）（其中R1和R2各自独立地表示氢原子，烷基或烷氧基，和 n为重复单元，1以上的整数）和通式（2）表示的化合物（a2）（式中，R 1和R 2各自独立地表示氢原子，烷基或烷氧基），式 存在于组合物中的通式（1）中n = 1且n = 2的化合物的总比例在10〜35％的范围内，通式（1）中n的平均值在 3.0〜7.0，组合物中化合物（a2）的含量为1〜6％。

公开(公告)号：US08168731B2

公开(公告)日：2012-05-01

申请号：US13124694

申请日：2009-08-07

Applicant: Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

Inventor： Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

IPC: B32B27/04 ,  C08L63/00 ,  H05K1/03

CPC classification number: C08G59/08 ,  C08G59/3218 ,  H05K1/03 ,  H05K1/0326 ,  Y10T156/10 ,  Y10T428/249951

Abstract: Provided is a curable resin composition that exhibits good heat resistance and low thermal expansion, and that realizes good solubility in solvents, a cured product thereof, a printed wiring board including the composition, a novel epoxy resin that imparts these properties, and a process for producing the same. A curable resin composition contains, as essential components, an epoxy resin (A) having, in its molecular structure, a glycidyloxy group and a skeleton in which a naphthalene structure and a cyclohexadienone structure are bonded to each other via methylene group(s); and a curing agent (B).

Abstract translation: 本发明提供一种固化性树脂组合物，它具有良好的耐热性和低热膨胀性，并且在溶剂中具有良好的溶解性，其固化产物，包含该组合物的印刷线路板，赋予这些性能的新型环氧树脂，和 生产相同。 固化性树脂组合物含有作为必要成分的环氧树脂（A），其分子结构中含有萘结构和环己二烯酮结构通过亚甲基彼此键合的缩水甘油氧基和骨架; 和固化剂（B）。

公开(公告)号：US20090099303A1

公开(公告)日：2009-04-16

申请号：US12280934

申请日：2006-11-10

Applicant: Kazuo Arita ,  Ichirou Ogura ,  Kunihiro Morinaga

Inventor： Kazuo Arita ,  Ichirou Ogura ,  Kunihiro Morinaga

IPC: C08L63/08 ,  C08G65/38

CPC classification number: C08G59/3218 ,  C08G59/245 ,  C08L63/00

Abstract: The invention provides an epoxy resin composition, a novel epoxy resin, a novel phenol resin and a semiconductor encapsulating material. The cured article of the epoxy resin composition has superior characteristics in flame retardancy, heat-resistant and curing. The epoxy resin composition is a preferable resin composition using in a semiconductor device or a circuit board device, and has the structure in which a naphthalene structure is bonded with an arylene group through an oxygen atom, and the total number of the aromatic nucleus in both the naphthalene structures and the arylenes group is 2-8. The epoxy resin composition essentially includes an epoxy resin (A) having the glycidoxy group as a substituent in the aromatic nucleus and a curing agent (B).

Abstract translation: 本发明提供环氧树脂组合物，新型环氧树脂，新型酚醛树脂和半导体封装材料。 环氧树脂组合物的固化物具有优异的阻燃性，耐热性和固化性。 环氧树脂组合物是在半导体装置或电路基板装置中使用的优选的树脂组合物，具有萘结构通过氧原子与亚芳基键合的结构，并且在两者中的芳香核总数 萘结构和亚芳基为2-8。 环氧树脂组合物基本上包括在芳环中具有缩水甘油氧基作为取代基的环氧树脂（A）和固化剂（B）。

公开(公告)号：US06794478B2

公开(公告)日：2004-09-21

申请号：US10252840

申请日：2002-09-24

Applicant: Ichiro Ogura ,  Kazuo Arita

Inventor： Ichiro Ogura ,  Kazuo Arita

IPC: C08G828

CPC classification number: C08G59/00 ,  C08G59/063

Abstract: A process for preparing an epoxy resin involves the reaction of a polyhydric phenol with an epihalohydrin in a water-soluble solvent in the presence of an alkali reactive catalyst wherein a continuous distillation of the reaction product is conducted to (1) isolate a first recovered fraction containing unreacted epihalohydnn, water-soluble solvent and at most 0.01 part by weight of the by-product glycidol per one part by weight of unreacted epihalohydrin; (2) isolate a second recovered fraction containing unreacted epihalohydrin, the by-product glycidol and at most 0.01 part by weight of water-soluble organic solvent per one part by weight of unreacted epihalohydrin; (3) recover the epihalohydrin from the second recovered fraction by washing with water to remove the water-soluble organic solvent and glycidol; and (4) reuse the first recovered fraction and the recovered epihalohydrin from the second recovered fraction as a raw material of the reaction.

Abstract translation: 制备环氧树脂的方法包括在碱反应性催化剂存在下，在水溶性溶剂中使多元酚与表卤代醇反应，其中进行反应产物的连续蒸馏以（1）将第一回收级分 含有未反应的表卤代水溶性溶剂和每1重量份未反应的表卤代醇至少0.01重量份的副产物缩水甘油;（2）分离含有未反应的表卤代醇，副产物缩水甘油和至多 0.01重量份的水溶性有机溶剂，每1重量份未反应的表卤代醇;（3）通过用水洗涤从第二回收部分中回收表卤代醇以除去水溶性有机溶剂和缩水甘油; 和（4）将来自第二回收级分的第一回收级分和回收的表卤代醇作为反应的原料再利用。