Invention Application
- Patent Title: Method of manufacturing a PCB having an embedded bare chip
- Patent Title (中): 制造具有嵌入式裸芯片的PCB的方法
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Application No.: US13067131Application Date: 2011-05-11
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Publication No.: US20110277320A1Publication Date: 2011-11-17
- Inventor: Kyung-Jin Han , Hyung-Tae Kim , Moon-il Kim , Jae-Kul Lee , Doo-Hwan Lee
- Applicant: Kyung-Jin Han , Hyung-Tae Kim , Moon-il Kim , Jae-Kul Lee , Doo-Hwan Lee
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2006-0012512 20060209
- Main IPC: H05K3/30
- IPC: H05K3/30
Abstract:
A method of manufacturing a PCB that includes embedding a bare chip in a board such that electrode pads of the bare chip are exposed, and forming electrode bumps on the electrode pads.
Public/Granted literature
- US08929091B2 Method of manufacturing a printed circuit board (PCB) Public/Granted day:2015-01-06
Information query
