公开(公告)号：US08929091B2

公开(公告)日：2015-01-06

申请号：US13067131

申请日：2011-05-11

申请人： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

发明人： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

IPC分类号： H05K1/16 ,  H01L23/538 ,  H01L23/13 ,  H01L23/00 ,  H05K1/18

CPC分类号： H01L23/5389 ,  H01L23/13 ,  H01L24/11 ,  H01L24/13 ,  H01L24/24 ,  H01L24/97 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H05K1/185 ,  Y10T29/4913 ,  H01L2224/13099 ,  H01L2224/05599

摘要： A method of manufacturing a printed circuit board (PCB) having an embedded bare chip includes attaching a tape to one side of an insulated substrate having a penetration hole formed therein, and attaching the bare chip onto the tape inside the penetration hole such that electrode pads of the bare chip face the tape; filling up the penetration hole with a filler, and removing the tape; laminating a metal layer onto a surface of the filler and the insulated substrate from which the tape is removed; and forming electrode bumps by removing portions of the metal layer. The forming of electrode bumps further includes simultaneously removing portions of the metal layer and forming an circuit pattern on one side of the insulated substrate. The circuit pattern is formed directly on the upper side of the insulated substrate and the electrode bumps are formed on the surface of the electrode pads.

摘要翻译： 一种制造具有嵌入式裸芯片的印刷电路板（PCB）的方法包括：将带粘附到具有形成在其中的穿透孔的绝缘基板的一侧，并将裸芯片附接到穿透孔内的带上，使得电极焊盘 的裸片面对磁带; 用填料填充贯通孔，取出胶带; 将金属层层压到填料的表面上以及除去带的绝缘基板; 以及通过去除金属层的部分形成电极凸块。 电极凸块的形成还包括同时去除金属层的部分并在绝缘基板的一侧上形成电路图案。 电路图案直接形成在绝缘基板的上侧，并且电极凸块形成在电极焊盘的表面上。

公开(公告)号：US08184448B2

公开(公告)日：2012-05-22

申请号：US11703814

申请日：2007-02-08

申请人： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

发明人： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

IPC分类号： H05K1/16

CPC分类号： H01L23/5389 ,  H01L23/13 ,  H01L24/11 ,  H01L24/13 ,  H01L24/24 ,  H01L24/97 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H05K1/185 ,  Y10T29/4913 ,  H01L2224/13099 ,  H01L2224/05599

摘要： A PCB having an embedded bare chip includes an insulated substrate having a penetration hole formed therein; a filler filling up an inside of the penetration hole; a bare chip embedded in the filler such that electrode pads formed on one side thereof are exposed at the surface of the filler; and an electrode bump attached to a surface of the electrode pads and protruded to be exposed to the outside.

摘要翻译： 具有嵌入式裸芯片的PCB包括其中形成有穿透孔的绝缘基板; 填充物穿透孔内部的填充物; 嵌入填料中的裸芯片，使得在其一侧形成的电极焊盘在填料的表面露出; 以及附着到电极焊盘的表面并突出以暴露于外部的电极凸块。

公开(公告)号：US20110277320A1

公开(公告)日：2011-11-17

申请号：US13067131

申请日：2011-05-11

申请人： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

发明人： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

IPC分类号： H05K3/30

CPC分类号： H01L23/5389 ,  H01L23/13 ,  H01L24/11 ,  H01L24/13 ,  H01L24/24 ,  H01L24/97 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H05K1/185 ,  Y10T29/4913 ,  H01L2224/13099 ,  H01L2224/05599

摘要： A method of manufacturing a PCB that includes embedding a bare chip in a board such that electrode pads of the bare chip are exposed, and forming electrode bumps on the electrode pads.

摘要翻译： 一种制造PCB的方法，包括将裸芯片嵌入板中，使得裸芯片的电极焊盘露出，并在电极焊盘上形成电极凸块。

公开(公告)号：US20110216513A1

公开(公告)日：2011-09-08

申请号：US12877684

申请日：2010-09-08

申请人： Doo-Hwan LEE ,  Sang-Jin Baek ,  Jin-Soo Jeong ,  Sang-Chul Lee ,  Jong-Yun Lee ,  Jae-Kul Lee

发明人： Doo-Hwan LEE ,  Sang-Jin Baek ,  Jin-Soo Jeong ,  Sang-Chul Lee ,  Jong-Yun Lee ,  Jae-Kul Lee

IPC分类号： H05K1/18 ,  H05K3/30

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K3/4602 ,  H05K3/465 ,  H05K3/4697 ,  Y10T29/4913 ,  Y10T29/49139

摘要： An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, a printed circuit board embedded with an electro device, in which a pair of electrodes are formed on either end, includes: a core substrate in which a first cavity is formed; a first passive device embedded in the first cavity and being thinner than the core substrate; and a second passive device stacked on an upper side of the first passive device such that the second passive device is embedded in the first cavity. The first passive device and the second passive device are stacked to cross each other.

摘要翻译： 公开了电子装置嵌入式印刷电路板及其制造方法。 根据本发明的实施例，嵌入电气装置的印刷电路板，其中一端形成一对电极，包括：形成有第一空腔的芯基板; 第一无源器件，其嵌入在所述第一腔中并且比所述芯基板更薄; 以及堆叠在所述第一无源器件的上侧上的第二无源器件，使得所述第二无源器件嵌入在所述第一腔中。 第一无源器件和第二无源器件被堆叠以彼此交叉。

公开(公告)号：US20070181988A1

公开(公告)日：2007-08-09

申请号：US11703814

申请日：2007-02-08

申请人： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

发明人： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L23/5389 ,  H01L23/13 ,  H01L24/11 ,  H01L24/13 ,  H01L24/24 ,  H01L24/97 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H05K1/185 ,  Y10T29/4913 ,  H01L2224/13099 ,  H01L2224/05599

摘要： A PCB having an embedded bare chip and a manufacturing method thereof are disclosed. A method of manufacturing a PCB may include embedding a bare chip in a board such that electrode pads of the bare chip are exposed, and forming electrode bumps on the electrode pads. In this way, the mass production system of a bare chip embedded PCB can be made to have a simplified process and low cost.

摘要翻译： 公开了具有嵌入式裸芯片的PCB及其制造方法。 制造PCB的方法可以包括将裸芯片嵌入板中，使得裸芯片的电极焊盘露出，并在电极焊盘上形成电极凸块。 这样，裸芯片嵌入式PCB的批量生产系统可以简化工艺，成本低廉。

公开(公告)号：US08284562B2

公开(公告)日：2012-10-09

申请号：US12877684

申请日：2010-09-08

申请人： Doo-Hwan Lee ,  Sang-Jin Baek ,  Jin-Soo Jeong ,  Sang-Chul Lee ,  Jong-Yun Lee ,  Jae-Kul Lee

发明人： Doo-Hwan Lee ,  Sang-Jin Baek ,  Jin-Soo Jeong ,  Sang-Chul Lee ,  Jong-Yun Lee ,  Jae-Kul Lee

IPC分类号： H05K1/18

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K3/4602 ,  H05K3/465 ,  H05K3/4697 ,  Y10T29/4913 ,  Y10T29/49139

摘要： An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, a printed circuit board embedded with an electro device, in which a pair of electrodes are formed on either end, includes: a core substrate in which a first cavity is formed; a first passive device embedded in the first cavity and being thinner than the core substrate; and a second passive device stacked on an upper side of the first passive device such that the second passive device is embedded in the first cavity. The first passive device and the second passive device are stacked to cross each other.

摘要翻译： 公开了电子装置嵌入式印刷电路板及其制造方法。 根据本发明的实施例，嵌入电气装置的印刷电路板，其中一端形成一对电极，包括：形成有第一空腔的芯基板; 第一无源器件，其嵌入在所述第一腔中并且比所述芯基板更薄; 以及堆叠在所述第一无源器件的上侧上的第二无源器件，使得所述第二无源器件嵌入在所述第一腔中。 第一无源器件和第二无源器件被堆叠以彼此交叉。

公开(公告)号：US07947906B2

公开(公告)日：2011-05-24

申请号：US11528322

申请日：2006-09-28

申请人： Doo-Hwan Lee ,  Je-Gwang Yoo ,  Seung-Gu Kim ,  Jae-Kul Lee ,  Moon-Il Kim ,  Hyung-Tae Kim

发明人： Doo-Hwan Lee ,  Je-Gwang Yoo ,  Seung-Gu Kim ,  Jae-Kul Lee ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC分类号： H05K3/02 ,  H05K1/00

CPC分类号： H05K1/185 ,  H01L23/13 ,  H01L23/142 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/021 ,  H05K1/053 ,  H05K3/4608 ,  H05K2201/09745 ,  H05K2201/10477 ,  H05K2201/10674 ,  H05K2203/0315 ,  Y10T29/49156 ,  H01L2924/00

摘要： A multi-layer printed circuit board and a method of manufacturing the multi-layer printed circuit board using a metal substrate as a core member and having an electronic component embedded in the metal substrate, the method including anodizing the metal substrate such that an anodic oxide layer is formed on upper and lower sides of the metal substrate, respectively; forming an inner layer circuit on upper and lower anodic oxide layers, respectively; etching the metal substrate to form a cavity in correspondence with a position where the electronic component is to be embedded; mounting the electronic component in the cavity with a chip bond adhesive; and forming an outer layer circuit on upper and lower sides of the metal substrate, respectively, such that a multi-layer circuit is formed.

摘要翻译： 一种多层印刷电路板和使用金属基板作为核心部件并且具有嵌入在金属基板中的电子部件的多层印刷电路板的制造方法，该方法包括阳极氧化金属基板以使阳极氧化物 层分别形成在金属基板的上侧和下侧; 分别在上下阳极氧化层上形成内层电路; 蚀刻金属基板以形成与要嵌入电子部件的位置相对应的空腔; 用芯片粘合剂将电子部件安装在腔体中; 并且在金属基板的上侧和下侧分别形成外层电路，使得形成多层电路。

公开(公告)号：US07812465B2

公开(公告)日：2010-10-12

申请号：US12232528

申请日：2008-09-18

申请人： Jae Kul Lee ,  Yul Kyo Chung

发明人： Jae Kul Lee ,  Yul Kyo Chung

IPC分类号： H01L23/544

CPC分类号： H01L23/544 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3114 ,  H01L24/02 ,  H01L24/16 ,  H01L24/25 ,  H01L24/82 ,  H01L2223/54426 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/19 ,  H01L2224/83121 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/0269 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4679 ,  H05K2201/09918

摘要： Disclosed is a semiconductor chip having an alignment mark which is formed on the surface of the semiconductor chip where no external connection bump is formed, and which has the position information of the external connection bump. A method of manufacturing the semiconductor chip having an alignment mark is also provided. Because the semiconductor chip includes the alignment mark having the position information of the external connection bump, the external connection bump is matched with a via which is formed in the external circuit layer of a printed circuit board including the semiconductor chip, thus improving electrical connection with the printed circuit board, and increasing the reliability of the printed circuit board including the semiconductor chip.

摘要翻译： 公开了一种具有对准标记的半导体芯片，其形成在半导体芯片的没有形成外部连接凸块的表面上，并具有外部连接凸块的位置信息。 还提供了具有对准标记的制造半导体芯片的方法。 由于半导体芯片包括具有外部连接凸块的位置信息的对准标记，所以外部连接凸块与形成在包括半导体芯片的印刷电路板的外部电路层中的通路匹配，从而改善与 印刷电路板，并且增加包括半导体芯片的印刷电路板的可靠性。

公开(公告)号：US20090315194A1

公开(公告)日：2009-12-24

申请号：US12232528

申请日：2008-09-18

申请人： Jae Kul Lee ,  Yul Kyo Chung

发明人： Jae Kul Lee ,  Yul Kyo Chung

IPC分类号： H01L23/544 ,  H01L21/76

CPC分类号： H01L23/544 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3114 ,  H01L24/02 ,  H01L24/16 ,  H01L24/25 ,  H01L24/82 ,  H01L2223/54426 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/19 ,  H01L2224/83121 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/0269 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4679 ,  H05K2201/09918

摘要： Disclosed is a semiconductor chip having an alignment mark which is formed on the surface of the semiconductor chip where no external connection bump is formed, and which has the position information of the external connection bump. A method of manufacturing the semiconductor chip having an alignment mark is also provided. Because the semiconductor chip includes the alignment mark having the position information of the external connection bump, the external connection bump is matched with a via which is formed in the external circuit layer of a printed circuit board including the semiconductor chip, thus improving electrical connection with the printed circuit board, and increasing the reliability of the printed circuit board including the semiconductor chip.

摘要翻译： 公开了一种具有对准标记的半导体芯片，其形成在半导体芯片的没有形成外部连接凸块的表面上，并具有外部连接凸块的位置信息。 还提供了具有对准标记的制造半导体芯片的方法。 由于半导体芯片包括具有外部连接凸块的位置信息的对准标记，所以外部连接凸块与形成在包括半导体芯片的印刷电路板的外部电路层中的通路匹配，从而改善与 印刷电路板，并且增加包括半导体芯片的印刷电路板的可靠性。

公开(公告)号：US07394249B2

公开(公告)日：2008-07-01

申请号：US10965613

申请日：2004-10-14

申请人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Jae-Kul Lee ,  Doo-Hwan Lee

发明人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Jae-Kul Lee ,  Doo-Hwan Lee

IPC分类号： G01R33/04

CPC分类号： G01R33/04 ,  H05K1/165 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/086 ,  H05K2201/10151

摘要： Disclosed is a printed circuit board with a weak magnetic field sensor according to the present invention, which includes a substrate having first excitation circuits and first detection circuits formed on both sides thereof. First laminates are layered on both sides of the substrate, and have soft magnetic cores with a predetermined shape formed thereon. Second laminates are layered on the first laminates, and have second excitation circuits and second detection circuits, connected through via holes to the first excitation circuits and first detection circuits, respectively, so that the first and second excitation circuits and first and second detection circuits are wound around the soft magnetic cores, formed thereon. The soft magnetic cores each include a magnetic core and non-magnetic metal layers formed on both sides of the magnetic core.

摘要翻译： 公开了根据本发明的具有弱磁场传感器的印刷电路板，其包括具有形成在其两侧上的第一激励电路和第一检测电路的基板。 第一层压体层叠在基板的两侧，并且具有形成在其上的预定形状的软磁芯。 第二层叠体层叠在第一层叠体上，并具有分别通过通孔与第一激励电路和第一检测电路连接的第二激励电路和第二检测电路，使得第一和第二激励电路以及第一和第二检测电路 缠绕在其上形成的软磁芯上。 软磁芯各自包括形成在磁芯两侧的磁芯和非磁性金属层。