发明申请
- 专利标题： MAGNETIC PARTICLE ATTACHMENT MATERIAL
- 专利标题（中）： 磁性颗粒附着材料
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申请号： US12777476申请日： 2010-05-11
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公开(公告)号： US20110278351A1公开(公告)日： 2011-11-17
- 发明人: Aleksandar Aleksov , Rajasekaran Swaminathan , Nachiket Raravikar
- 申请人： Aleksandar Aleksov , Rajasekaran Swaminathan , Nachiket Raravikar
- 主分类号： B23K31/02
- IPC分类号： B23K31/02 ; B23K1/20
摘要：
The present disclosure relates to the field of fabricating microelectronic packages, wherein a magnetic particle attachment material comprising magnetic particles distributed within a carrier material may be used to achieve attachment between microelectronic components. The magnetic particle attachment material may be exposed to a magnetic field, which, through the vibration of the magnetic particles within the magnetic particle attachment material, can heat a solder material to a reflow temperature for attaching microelectronic components of the microelectronic packages.
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