发明申请
- 专利标题： SOLID-STATE IMAGE SENSING DEVICE HAVING A DIRECT-ATTACHMENT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- 专利标题（中）： 具有直接附着结构的固态图像感测装置及其制造方法
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申请号： US13192155申请日： 2011-07-27
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公开(公告)号： US20110278692A1公开(公告)日： 2011-11-17
- 发明人: Yasuo TAKEUCHI , Tomoko Komatsu , Masashi Kuroda , Tetsushi Nishio , Kiyokazu Itoi
- 申请人： Yasuo TAKEUCHI , Tomoko Komatsu , Masashi Kuroda , Tetsushi Nishio , Kiyokazu Itoi
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 优先权： JP2007-259025 20071002
- 主分类号： H01L31/0203
- IPC分类号： H01L31/0203
摘要：
A solid-state image sensing element includes an effective pixel section in a central area of a light receiving surface thereof, and a ridge-shaped protruding portion is provided around the effective pixel section. A liquid transparent adhesive is applied on the effective pixel section, and a light transparent substrate is placed thereon. The light transparent substrate is in contact with the protruding portion, and is therefore prevented from sliding with the liquid adhesive serving as a lubricant. Thus, the light transparent substrate can be fixed at a predetermined position.
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