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1.发明申请SOLID-STATE IMAGING ELEMENT, METHOD FOR FABRICATING THE SAME, AND SOLID-STATE IMAGING DEVICE 审中-公开固态成像元件，其制造方法和固态成像装置公开(公告)号：US20100224948A1
公开(公告)日：2010-09-09
申请号：US12783086
申请日：2010-05-19
IPC分类号： H01L31/0232 , H01L31/18 , H01L31/0216
CPC分类号： G02B3/0006 , H01L27/14618 , H01L27/14627 , H01L27/14683 , H01L2224/16 , H01L2224/48091 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/3025 , H01L2224/0401
摘要： A solid-state imaging element includes a semiconductor substrate formed with a valid pixel section including a plurality of photodetector sections, spacers formed on the valid pixel section, a transparent adhesive filling gaps among the spacers, and a transparent substrate which is bonded onto the spacers using the transparent adhesive and covers the valid pixel section when viewed in plan. Electrode pad sections are formed in a region of the semiconductor substrate located outside the valid pixel section.
摘要翻译： 固态成像元件包括形成有有效像素部分的半导体衬底，该有效像素部分包括多个光电检测器部分，形成在有效像素部分上的间隔物，填充间隔物之间的间隙的透明粘合剂和粘合到间隔物上的透明基板 使用透明粘合剂并在计划中观察时覆盖有效像素部分。 电极焊盘部分形成在位于有效像素部分外部的半导体衬底的区域中。
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公开(公告)号：US20090085139A1
公开(公告)日：2009-04-02
申请号：US12237890
申请日：2008-09-25
CPC分类号： H01L27/14618 , H01L27/14627 , H01L27/14683 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： A solid-state image sensing element includes an effective pixel section in a central area of a light receiving surface thereof, and a ridge-shaped protruding portion is provided around the effective pixel section. A liquid transparent adhesive is applied on the effective pixel section, and a light transparent substrate is placed thereon. The light transparent substrate is in contact with the protruding portion, and is therefore prevented from sliding with the liquid adhesive serving as a lubricant. Thus, the light transparent substrate can be fixed at a predetermined position.
摘要翻译： 固态摄像元件包括在其受光面的中央区域的有效像素部，并且在有效像素部的周围设置有脊状的突出部。 将液体透明粘合剂施加在有效像素部分上，并且将透光基板放置在其上。 透光性基板与突出部接触，因此防止与作为润滑剂的液体粘合剂滑动。 因此，可以将光透明基板固定在预定位置。
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3.发明申请SOLID-STATE IMAGE SENSING DEVICE HAVING A DIRECT-ATTACHMENT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME 审中-公开具有直接附着结构的固态图像感测装置及其制造方法公开(公告)号：US20110278692A1
公开(公告)日：2011-11-17
申请号：US13192155
申请日：2011-07-27
IPC分类号： H01L31/0203
CPC分类号： H01L27/14618 , H01L27/14627 , H01L27/14683 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： A solid-state image sensing element includes an effective pixel section in a central area of a light receiving surface thereof, and a ridge-shaped protruding portion is provided around the effective pixel section. A liquid transparent adhesive is applied on the effective pixel section, and a light transparent substrate is placed thereon. The light transparent substrate is in contact with the protruding portion, and is therefore prevented from sliding with the liquid adhesive serving as a lubricant. Thus, the light transparent substrate can be fixed at a predetermined position.
摘要翻译： 固态摄像元件包括在其受光面的中央区域的有效像素部，并且在有效像素部的周围设置有脊状的突出部。 将液体透明粘合剂施加在有效像素部分上，并且将透光基板放置在其上。 透光性基板与突出部接触，因此防止与作为润滑剂的液体粘合剂滑动。 因此，可以将光透明基板固定在预定位置。
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公开(公告)号：US07646539B2
公开(公告)日：2010-01-12
申请号：US12401904
申请日：2009-03-11
摘要： An optical device includes a substrate, a plurality of optical elements formed in an element formation region of the substrate, a plurality of lenses formed over the element formation region so as to correspond to the plurality of optical elements, and a protective layer formed so as to cover the plurality of lenses. A holding member is formed on the protective layer in a region outside the element formation region. The holding member holds a bottom surface of a transparent member. A gap between the protective layer and the transparent member is filled with an adhesive.
摘要翻译： 光学装置包括基板，形成在基板的元件形成区域中的多个光学元件，在元件形成区域上形成为与多个光学元件对应的多个透镜，以及形成为 以覆盖多个透镜。 在元件形成区域外的区域中的保护层上形成保持构件。 保持构件保持透明构件的底面。 保护层和透明构件之间的间隙填充有粘合剂。
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公开(公告)号：US20090237796A1
公开(公告)日：2009-09-24
申请号：US12401904
申请日：2009-03-11
摘要： An optical device includes a substrate, a plurality of optical elements formed in an element formation region of the substrate, a plurality of lenses formed over the element formation region so as to correspond to the plurality of optical elements, and a protective layer formed so as to cover the plurality of lenses. A holding member is formed on the protective layer in a region outside the element formation region. The holding member holds a bottom surface of a transparent member. A gap between the protective layer and the transparent member is filled with an adhesive.
摘要翻译： 光学装置包括基板，形成在基板的元件形成区域中的多个光学元件，在元件形成区域上形成为与多个光学元件对应的多个透镜，以及形成为 以覆盖多个透镜。 在元件形成区域外的区域中的保护层上形成保持构件。 保持构件保持透明构件的底面。 保护层和透明构件之间的间隙填充有粘合剂。
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公开(公告)号：US07977138B1
公开(公告)日：2011-07-12
申请号：US12929795
申请日：2011-02-16
申请人： Hu Meng , Hiroto Osaki , Tetsushi Nishio , Kiyokazu Itoi
发明人： Hu Meng , Hiroto Osaki , Tetsushi Nishio , Kiyokazu Itoi
IPC分类号： H01L21/00 , H01L21/50 , H01L21/48 , H01L31/0203
CPC分类号： H01L27/14618 , H01L31/0203 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2224/73265 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An optical device includes a semiconductor substrate (11) on which a light receiving part (12) (or a light emitting part) and electrodes (13) are formed, and a translucent plate (2) bonded on the light receiving part (12) with a translucent adhesive (5), the semiconductor substrate (11) having a plurality of convex portions (31) formed so as to separate the light receiving part (12) and the electrodes (13) and have proper gaps (32) therebetween.
摘要翻译： 光学器件包括：半导体衬底（11），其上形成有光接收部分（12）（或发光部分）和电极（13）;以及半透明板（2），其接合在光接收部分（12）上， 通过半透明粘合剂（5），半导体衬底（11）具有形成为分离光接收部分（12）和电极（13）的多个凸部（31），并且在它们之间具有适当的间隙（32）。
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公开(公告)号：US07911018B2
公开(公告)日：2011-03-22
申请号：US12209233
申请日：2008-09-12
申请人： Hu Meng , Hiroto Osaki , Tetsushi Nishio , Kiyokazu Itoi
发明人： Hu Meng , Hiroto Osaki , Tetsushi Nishio , Kiyokazu Itoi
IPC分类号： H01L31/0203 , H01L23/02
CPC分类号： H01L27/14618 , H01L31/0203 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2224/73265 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An optical device includes a semiconductor substrate (11) on which a light receiving part (12) (or a light emitting part) and electrodes (13) are formed, and a translucent plate (2) bonded on the light receiving part (12) with a translucent adhesive (5), the semiconductor substrate (11) having a plurality of convex portions (31) formed so as to separate the light receiving part (12) and the electrodes (13) and have proper gaps (32) therebetween.
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8.发明申请OPTICAL DEVICE AND METHOD FOR MANUFACTURING OPTICAL DEVICE, AND CAMERA MODULE AND ENDOSCOPE MODULE EQUIPPED WITH OPTICAL DEVICE 有权用于制造光学装置的光学装置和方法，以及配备有光学装置的相机模块和内窥镜模块公开(公告)号：US20080185603A1
公开(公告)日：2008-08-07
申请号：US11968763
申请日：2008-01-03
IPC分类号： H01L33/00 , H01L31/0203 , H01L31/18
CPC分类号： A61B1/05 , H01L24/94 , H01L27/14618 , H01L27/14636 , H01L27/14687 , H01L31/0203 , H01L33/486 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H04N5/2251 , H04N5/2252 , H04N5/2254 , H01L2924/00014 , H01L2924/00
摘要： An optical device is equipped with a light receiving region 16a and a peripheral circuit region 22 located around the light receiving region 16a on a major surface of an light receiving element 11a; electrodes for external connection 15 electrically connected to the peripheral circuit region 22 formed on a back surface opposite to the major surface of the light receiving element 11a; a transparent member 12 covering the light receiving region 16a adhered on the major surface of the light receiving element 11a with a light-transmitting adhesive 13; and a molding resin 14 for coating side surfaces of the transparent member 12 and the major surface of the light receiving element 11a excluding the region covered with the transparent member 12.
摘要翻译： 光学装置配备有光接收区域16a和在光接收元件11a的主表面上的光接收区域16a周围的外围电路区域22; 电连接到形成在与光接收元件11a的主表面相反的背面上的外围电路区域22的外部连接电极15; 覆盖受光元件11a的主表面上的光接收区域16a的透光构件12，其具有透光性粘合剂13; 以及用于涂覆透明构件12的侧表面和光接收元件11a的主表面的模制树脂14，除了被透明构件12覆盖的区域。
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9.发明授权Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical device 有权用于制造光学装置的光学装置和方法，以及装备有光学装置的相机模块和内窥镜模块公开(公告)号：US08455902B2
公开(公告)日：2013-06-04
申请号：US13193075
申请日：2011-07-28
IPC分类号： H01L31/0203
CPC分类号： A61B1/05 , H01L24/94 , H01L27/14618 , H01L27/14636 , H01L27/14687 , H01L31/0203 , H01L33/486 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H04N5/2251 , H04N5/2252 , H04N5/2254 , H01L2924/00014 , H01L2924/00
摘要： An optical device is equipped with a light receiving region 16a and a peripheral circuit region 22 located around the light receiving region 16a on a major surface of an light receiving element 11a; electrodes for external connection 15 electrically connected to the peripheral circuit region 22 formed on a back surface opposite to the major surface of the light receiving element 11a; a transparent member 12 covering the light receiving region 16a adhered on the major surface of the light receiving element 11a with a light-transmitting adhesive 13; and a molding resin 14 for coating side surfaces of the transparent member 12 and the major surface of the light receiving element 11a excluding the region covered with the transparent member 12.
摘要翻译： 光学装置配备有光接收区域16a和位于光接收元件11a的主表面上的光接收区域16a周围的外围电路区域22; 电连接到形成在与光接收元件11a的主表面相反的背面上的外围电路区域22的外部连接用电极15; 透明构件12，用透光性粘接剂13覆盖粘接在受光元件11a的主表面上的受光区域16a; 以及用于涂覆透明构件12的侧表面和除了透明构件12覆盖的区域之外的光接收元件11a的主表面的模塑树脂14。
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10.发明授权Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical device 有权用于制造光学装置的光学装置和方法，以及装备有光学装置的相机模块和内窥镜模块公开(公告)号：US08013350B2
公开(公告)日：2011-09-06
申请号：US11968763
申请日：2008-01-03
IPC分类号： H01L31/0203
CPC分类号： A61B1/05 , H01L24/94 , H01L27/14618 , H01L27/14636 , H01L27/14687 , H01L31/0203 , H01L33/486 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H04N5/2251 , H04N5/2252 , H04N5/2254 , H01L2924/00014 , H01L2924/00
摘要： An optical device is equipped with a light receiving region 16a and a peripheral circuit region 22 located around the light receiving region 16a on a major surface of an light receiving element 11a; electrodes for external connection 15 electrically connected to the peripheral circuit region 22 formed on a back surface opposite to the major surface of the light receiving element 11a; a transparent member 12 covering the light receiving region 16a adhered on the major surface of the light receiving element 11a with a light-transmitting adhesive 13; and a molding resin 14 for coating side surfaces of the transparent member 12 and the major surface of the light receiving element 11a excluding the region covered with the transparent member 12.
摘要翻译： 光学装置配备有光接收区域16a和位于光接收元件11a的主表面上的光接收区域16a周围的外围电路区域22; 电连接到形成在与光接收元件11a的主表面相反的背面上的外围电路区域22的外部连接用电极15; 透明构件12，用透光性粘接剂13覆盖粘接在受光元件11a的主表面上的受光区域16a; 以及用于涂覆透明构件12的侧表面和除了透明构件12覆盖的区域之外的光接收元件11a的主表面的模塑树脂14。
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