发明申请
- 专利标题： SEMICONDUCTOR DEVICE
- 专利标题（中）： 半导体器件
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申请号： US13195325申请日： 2011-08-01
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公开(公告)号： US20110278723A1公开(公告)日： 2011-11-17
- 发明人: Takao Nishimura , Yoshikazu Kumagaya , Akira Takashima , Kouichi Nakamura , Kazuyuki Aiba
- 申请人： Takao Nishimura , Yoshikazu Kumagaya , Akira Takashima , Kouichi Nakamura , Kazuyuki Aiba
- 申请人地址： JP Yokohama-shi
- 专利权人： FUJITSU SEMICONDUCTOR LIMITED
- 当前专利权人： FUJITSU SEMICONDUCTOR LIMITED
- 当前专利权人地址： JP Yokohama-shi
- 优先权： JP2005-188887 20050628; JP2006-061759 20060307
- 主分类号： H01L23/498
- IPC分类号： H01L23/498
摘要：
A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.
公开/授权文献
- US08810043B2 Semiconductor device 公开/授权日：2014-08-19
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