发明申请
- 专利标题： MOUNTING STRUCTURE
- 专利标题（中）： 安装结构
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申请号： US13110136申请日： 2011-05-18
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公开(公告)号： US20110284278A1公开(公告)日： 2011-11-24
- 发明人: Kiyohiro Hine , Shigeaki Sakatani , Akio Furusawa
- 申请人： Kiyohiro Hine , Shigeaki Sakatani , Akio Furusawa
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 优先权： JP2010-116353 20100520
- 主分类号： H05K1/18
- IPC分类号： H05K1/18
摘要：
A mounting structure includes an insulating substrate having a substrate electrode on which at least one electrode notch is provided and a resist, an electronic component having an electronic component electrode to be electrically connected to the substrate electrode, and solder paste printed on a surface of the substrate electrode. The substrate electrode has a following relation, 0
公开/授权文献
- US08552307B2 Mounting structure 公开/授权日：2013-10-08
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