发明申请
- 专利标题： Electrically Broken, but Mechanically Continuous Die Seal for Integrated Circuits
- 专利标题（中）： 集成电路的断路，但机械连续的模具密封
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申请号： US12784706申请日： 2010-05-21
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公开(公告)号： US20110284994A1公开(公告)日： 2011-11-24
- 发明人: David Bang , Thomas Andrew Myers
- 申请人： David Bang , Thomas Andrew Myers
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM Incorporated
- 当前专利权人： QUALCOMM Incorporated
- 当前专利权人地址： US CA San Diego
- 主分类号： H01L23/58
- IPC分类号： H01L23/58 ; H01L21/50
摘要：
A semiconductor die has multiple discontinuous conductive segments arranged around a periphery of the semiconductor die, and an electrically insulating barrier within discontinuities between the conductive segments. The conductive segments and the barriers form a mechanically continuous seal ring around the semiconductor die.
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