摘要:
This disclosure provides systems, methods and apparatus for combining devices deposited on a first substrate, with integrated circuits formed on a second substrate such as a semiconducting substrate or a glass substrate. The first substrate may be a glass substrate. The first substrate may include conductive vias. A power combiner circuit may be deposited on a first side of the first substrate. The power combiner circuit may include passive devices deposited on at least the first side of the first substrate. The integrated circuit may include a power amplifier circuit disposed on and configured for electrical connection with the power combiner circuit, to form a power amplification system. The conductive vias may include thermal vias configured for conducting heat from the power amplification system and/or interconnect vias configured for electrical connection between the power amplification system and a conductor on a second side of the first substrate.
摘要:
This disclosure provides systems, methods and apparatus for combining devices deposited on a first substrate, with integrated circuits formed on a second substrate such as a semiconducting substrate or a glass substrate. The first substrate may be a glass substrate. The first substrate may include conductive vias. A power combiner circuit may be deposited on a first side of the first substrate. The power combiner circuit may include passive devices deposited on at least the first side of the first substrate. The integrated circuit may include a power amplifier circuit disposed on and configured for electrical connection with the power combiner circuit, to form a power amplification system. The conductive vias may include thermal vias configured for conducting heat from the power amplification system and/or interconnect vias configured for electrical connection between the power amplification system and a conductor on a second side of the first substrate.
摘要:
An integrated data controller that utilizes a first-in first-out (FIFO) management system that compensates for the unpredictable nature of latency associated with requesting data from memory and enables the timing of data requests to be determined based on the number of pending requests and the amount of data currently residing in the buffer. The FIFO management system includes a FIFO controller and a FIFO buffer that monitor a credit value and a trigger value to determine when to make data request bursts upon a memory unit. The trigger value is an indication of whether there is a sufficient amount of free space for it to be beneficial to make a data request burst and the credit value is a number that indicates the number of a data blocks that should be requested in the data request burst.
摘要:
A semiconductor die has multiple discontinuous conductive segments arranged around a periphery of the semiconductor die, and an electrically insulating barrier within discontinuities between the conductive segments. The conductive segments and the barriers form a mechanically continuous seal ring around the semiconductor die.
摘要:
A system and method for enabling a programmable device to execute instructions without interruption. An instruction space for storing instructions from a host application is bifurcated to define a program segment and a hold segment. At startup, instructions are loaded into the hold segment, and the programmable device begins executing those instructions. While the hold segment instructions are executed, the program segment is loaded with instructions. Once the program segment is filled, control is shifted to it and instructions from this segment are executed by the programmable device. When the program segment has been executed, control is shifted back to the hold segment, and instructions are taken from it while the program segment is reloaded with a fresh set of instructions from the host application. Once the program segment is reloaded, control is redirected and execution of instructions from the program segment is continued.
摘要:
An impedance matching circuit is disclosed. The impedance matching circuit includes two or more mutually coupled inductors. A total self inductance of the impedance matching circuit is less than a corresponding impedance matching circuit that includes inductors that are not mutually coupled. The two or more mutually coupled inductors may have known current ratios that match current ratios in the corresponding impedance matching circuit.
摘要:
A semiconductor die has multiple discontinuous conductive segments arranged around a periphery of the semiconductor die, and an electrically insulating barrier within discontinuities between the conductive segments. The conductive segments and the barriers form a mechanically continuous seal ring around the semiconductor die.