发明申请
US20110286188A1 MULTILAYER PRINTED CIRCUIT BOARD USING FLEXIBLE INTERCONNECT STRUCTURE, AND METHOD OF MAKING SAME
审中-公开
使用柔性互连结构的多层印刷电路板及其制造方法
- 专利标题： MULTILAYER PRINTED CIRCUIT BOARD USING FLEXIBLE INTERCONNECT STRUCTURE, AND METHOD OF MAKING SAME
- 专利标题（中）： 使用柔性互连结构的多层印刷电路板及其制造方法
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申请号： US13048056申请日： 2011-03-15
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公开(公告)号： US20110286188A1公开(公告)日： 2011-11-24
- 发明人: Ryo KANAI , Shunichi KIKUCHI , Naoki NAKAMURA , Shigeru SUGINO , Kiyoyuki HATANAKA , Nobuo TAKETOMI
- 申请人： Ryo KANAI , Shunichi KIKUCHI , Naoki NAKAMURA , Shigeru SUGINO , Kiyoyuki HATANAKA , Nobuo TAKETOMI
- 申请人地址： JP Kawasaki-shi
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 当前专利权人地址： JP Kawasaki-shi
- 优先权： JP2010-117011 20100521
- 主分类号： H05K5/00
- IPC分类号： H05K5/00 ; H01L21/50 ; H05K1/18
摘要：
A multilayer printed circuit board includes an interior interconnect layer, and a semiconductor package including a flexible interconnect structure whose distal end is a free end, wherein the flexible interconnect structure and the interior interconnect layer are electrically connected to each other.
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