公开(公告)号：US07951249B2

公开(公告)日：2011-05-31

申请号：US11704321

申请日：2007-02-09

申请人： Shunichi Kikuchi ,  Masumi Suzuki ,  Michimasa Aoki

发明人： Shunichi Kikuchi ,  Masumi Suzuki ,  Michimasa Aoki

IPC分类号： B32B41/00

CPC分类号： G06K19/0773 ,  B31D1/028 ,  G06K19/07749 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3025 ,  Y10T29/49117 ,  Y10T156/10 ,  Y10T156/1056 ,  Y10T156/1062 ,  H01L2224/0401

摘要： The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.

摘要翻译： 本发明提供了热扩散性优异的RFID标签。 RFID标签包括：基座，设置在基座上并形成通信天线的天线图案，与天线图形电连接并通过天线进行无线通信的电路芯片，与所述天线图案紧密接触地设置的盖 该基底以覆盖包括电路芯片的规定区域以外的天线图案，以及覆盖规定区域并与电路芯片热接触的绝缘热扩散材料。 绝缘热扩散材料的导热系数高于盖的热导率。

公开(公告)号：US06303877B2

公开(公告)日：2001-10-16

申请号：US09109912

申请日：1998-07-02

申请人： Kiyokazu Moriizumi ,  Shunichi Kikuchi ,  Naomi Fukunaga

发明人： Kiyokazu Moriizumi ,  Shunichi Kikuchi ,  Naomi Fukunaga

IPC分类号： H01R909

CPC分类号： H05K1/115 ,  H01L23/49816 ,  H01L23/5384 ,  H01L2224/16225 ,  H01L2924/15322 ,  H05K1/113 ,  H05K3/467 ,  H05K2201/096 ,  H05K2201/0979

摘要： A multilayer thin-film wiring board including a base material provided with a plurality of wiring layers and an insulating layer laminated on the base material, and including a via formed by laminating the wiring layers so as to be provide through the insulating layer. A plurality of branching vias are provided by forming a plurality of branches in one of the wiring layers forming the via, the plurality of branching vias being placed along a direction of extension of the base material. The plurality of branching vias are joined to the one of the plurality of wiring layers which is placed at a position closest to the base material.

摘要翻译： 一种多层薄膜布线板，包括设置有多个布线层的基材和层叠在基材上的绝缘层，并且包括通过层叠布线层而形成的通孔，以便通过绝缘层提供。 通过在形成通孔的布线层之一中形成多个分支来提供多个分支通孔，多个分支通孔沿着基材的延伸方向放置。 多个分支通孔连接到放置在最接近基材的位置的多个布线层中的一个。

公开(公告)号：US06300678B1

公开(公告)日：2001-10-09

申请号：US09184081

申请日：1998-11-02

申请人： Mitsuo Suehiro ,  Satoshi Osawa ,  Shunichi Kikuchi

发明人： Mitsuo Suehiro ,  Satoshi Osawa ,  Shunichi Kikuchi

IPC分类号： H01L2348

CPC分类号： H01L24/01 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3426 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00

摘要： There is provided an I/O pin by which an MCM is positively prevented from being damaged by solder flowing from the fore end to the base of the I/O pin when the I/O pin is soldered in the case of mounting the MCM. An I/O pin used for an electrical connection is provided, one end of which is perpendicularly fixed to an MCM and the other end of which is soldered to a predetermined position on the mother board in the case of mounting the MCM on the mother board. In an intermediate portion of the I/O pin, there is formed a solder dam composed of a plated layer of Ni of low solder wettability, a layer of highly heat-resistant resin or a layer of high-temperature solder.

摘要翻译： 在安装MCM的情况下，当I / O引脚被焊接时，提供了一个I / O引脚，通过该引脚可以有效地防止MCM从焊接头从I / O引脚的前端流到基座的损坏。 设置用于电连接的I / O引脚，其一端垂直固定于MCM，另一端在将MCM安装在母板上的情况下焊接到母板上的预定位置 。 在I / O引脚的中间部分形成有由低焊料润湿性的Ni的镀层，高耐热树脂层或高温焊料层构成的焊料坝。

公开(公告)号：US6054652A

公开(公告)日：2000-04-25

申请号：US942387

申请日：1997-10-10

申请人： Kiyokazu Moriizumi ,  Shunichi Kikuchi ,  Kazuhiro Nitta ,  Naomi Fukunaga ,  Mitsuo Suehiro

发明人： Kiyokazu Moriizumi ,  Shunichi Kikuchi ,  Kazuhiro Nitta ,  Naomi Fukunaga ,  Mitsuo Suehiro

IPC分类号： H05K3/34 ,  H01L23/12 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K1/11 ,  H05K3/46 ,  H01R12/04 ,  H01R12/32

CPC分类号： H01L23/5384 ,  H01L23/49811 ,  H05K1/112 ,  H01L2224/16225 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K1/0298 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10318 ,  H05K3/467

摘要： The thin-film multi-layer substrate includes an insulating substrate base plate, and a thin-film structure including a plurality of conducting layers and a plurality of insulating layers formed on the substrate base plate. A via structure is formed in the thin-film structure and connected to one of the conducting layers of the thin-layer structure. Pins are connected to the via structure, such that the bottom of the via structure is directly laminated on the substrate base plate, and the pins are secured onto the via structure.

摘要翻译： 薄膜多层基板包括绝缘基板基板和包括多个导电层和形成在基板基板上的多个绝缘层的薄膜结构。 在薄膜结构中形成通孔结构并连接到薄层结构的导电层之一。 引脚连接到通孔结构，使得通孔结构的底部直接层压在基板基板上，并且引脚固定到通孔结构上。

公开(公告)号：US5894882A

公开(公告)日：1999-04-20

申请号：US650029

申请日：1996-05-17

申请人： Shunichi Kikuchi ,  Minoru Hirano ,  Kiyotaka Seyama ,  Hideaki Yoshimura ,  Takashi Kanda ,  Hitoshi Nori

发明人： Shunichi Kikuchi ,  Minoru Hirano ,  Kiyotaka Seyama ,  Hideaki Yoshimura ,  Takashi Kanda ,  Hitoshi Nori

IPC分类号： H01L23/36 ,  F28F3/02 ,  H01L23/367 ,  H01L23/467 ,  F28F7/00 ,  H01L23/46

CPC分类号： H01L23/3672 ,  F28F3/027 ,  H01L23/467 ,  H01L2924/0002

摘要： A heat sink structure of a module substrate includes a plurality of stripe-like bottom regions extending in a longitudinal direction and repeated in a lateral direction with a predetermined pitch, a plurality of stripe-like top regions extending in said longitudinal direction and repeated in the lateral direction with said predetermined pitch, such that the stripe-like bottom regions and the stripe-like top regions are repeated alternately in the lateral direction, wherein the stripe-like top regions and the stripe-like bottom regions have respective lateral edges that are connected with each other by cooling fins.

摘要翻译： 模块基板的散热结构包括沿着纵向方向延伸并且以预定间距在横向上重复的多个条状底部区域，沿着所述纵向方向延伸并在所述纵向方向上重复的多个条状顶部区域 横向具有所述预定间距，使得条状底部区域和条状顶部区域在横向方向上交替重复，其中条状顶部区域和条形底部区域具有相应的横向边缘， 通过散热片相互连接。

公开(公告)号：US5763950A

公开(公告)日：1998-06-09

申请号：US598331

申请日：1996-02-08

申请人： Akihiko Fujisaki ,  Junichi Ishimine ,  Masumi Suzuki ,  Masahiro Miyo ,  Shunichi Kikuchi ,  Minoru Hirano ,  Hitoshi Nori

发明人： Akihiko Fujisaki ,  Junichi Ishimine ,  Masumi Suzuki ,  Masahiro Miyo ,  Shunichi Kikuchi ,  Minoru Hirano ,  Hitoshi Nori

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/433 ,  H01L23/467 ,  H01L23/473 ,  H01L29/06 ,  H01L23/34

CPC分类号： H01L23/3672 ,  H01L23/3677 ,  H01L23/433 ,  H01L23/4336 ,  H01L23/467 ,  H01L23/473 ,  H01L2224/16 ,  H01L29/0657 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01068

摘要： A semiconductor element cooling apparatus adapted to cool at least one semiconductor element mounted on a circuit substrate. The semiconductor element cooling apparatus includes a first mechanism for generating a coolant flow by flowing a coolant over a top surface of the semiconductor element, and a second mechanism for obliquely obstructing the coolant flowing over the semiconductor element from an upstream side towards a downstream side of the coolant flow.

摘要翻译： 一种适于冷却安装在电路基板上的至少一个半导体元件的半导体元件冷却装置。 半导体元件冷却装置包括：第一机构，用于通过在半导体元件的顶表面上流动冷却剂来产生冷却剂流;以及第二机构，用于将流过半导体元件的冷却剂从上游侧向下游侧倾斜地阻塞 冷却液流动。

公开(公告)号：US5050037A

公开(公告)日：1991-09-17

申请号：US251978

申请日：1988-09-29

申请人： Haruhiko Yamamoto ,  Kouji Katsuyama ,  Mitsuhiko Nakata ,  Shunichi Kikuchi

发明人： Haruhiko Yamamoto ,  Kouji Katsuyama ,  Mitsuhiko Nakata ,  Shunichi Kikuchi

IPC分类号： H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/4735 ,  H01L23/4332 ,  H01L2224/48091

摘要： A printed circuit board assembly having a printed circuit board mounted, on both faces, heat generative electronic circuit components, such as integrated circuit chips, and a pair of liquid-cooling modules arranged on both sides of the printed circuit board. Each of the liquid-cooling modules is provided with a liquid cooling plate having liquid coolant supply heads and a plurality of resilient heat transfer units held by the liquid-cooling plate and arranged in compressive contact with the electronic circuit components on both faces of the printed circuit board.

摘要翻译： 一种印刷电路板组件，其具有安装在两面上的印刷电路板，诸如集成电路芯片的热生成电子电路部件和布置在印刷电路板两侧的一对液体冷却模块。 每个液冷模块设置有具有液体冷却剂供给头的液体冷却板和由液体冷却板保持的多个弹性传热单元，并且与印刷的两面上的电子电路部件压电接触 电路板。

公开(公告)号：US4879632A

公开(公告)日：1989-11-07

申请号：US914942

申请日：1986-10-03

申请人： Haruhiko Yamamoto ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Mitsuhiko Nakata ,  Koji Katsuyama ,  Izumi Ono ,  Shunichi Kikuchi

发明人： Haruhiko Yamamoto ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Mitsuhiko Nakata ,  Koji Katsuyama ,  Izumi Ono ,  Shunichi Kikuchi

IPC分类号： G02F1/00 ,  G11B5/64 ,  G11B11/105 ,  H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/4735 ,  G02F1/0036 ,  G11B11/10591 ,  G11B5/64 ,  H01L23/4332 ,  H01L2224/48091

摘要： A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.

摘要翻译： 冷却系统包括冷却模块，该冷却模块具有弹性偏置并暴露于冷却剂流动的传热板，用于将从印刷电路板上的电路部件散发的热量传递到冷却剂，以及焊料或低熔点金属 用于在转印板和电路部件之间建立热接触。

公开(公告)号：US20110286188A1

公开(公告)日：2011-11-24

申请号：US13048056

申请日：2011-03-15

申请人： Ryo KANAI ,  Shunichi KIKUCHI ,  Naoki NAKAMURA ,  Shigeru SUGINO ,  Kiyoyuki HATANAKA ,  Nobuo TAKETOMI

发明人： Ryo KANAI ,  Shunichi KIKUCHI ,  Naoki NAKAMURA ,  Shigeru SUGINO ,  Kiyoyuki HATANAKA ,  Nobuo TAKETOMI

IPC分类号： H05K5/00 ,  H01L21/50 ,  H05K1/18

CPC分类号： H05K1/185 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/06181 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H05K1/186 ,  H05K3/4602 ,  H05K3/4691 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2203/063 ,  H05K2203/1469 ,  H01L2924/00

摘要： A multilayer printed circuit board includes an interior interconnect layer, and a semiconductor package including a flexible interconnect structure whose distal end is a free end, wherein the flexible interconnect structure and the interior interconnect layer are electrically connected to each other.

摘要翻译： 多层印刷电路板包括内部互连层和包括其前端是自由端的柔性互连结构的半导体封装，其中柔性互连结构和内部互连层彼此电连接。

公开(公告)号：US20110132654A1

公开(公告)日：2011-06-09

申请号：US12959698

申请日：2010-12-03

申请人： Nobuo TAKETOMI ,  Shunichi KIKUCHI ,  Naoki NAKAMURA ,  Kiyoyuki HATANAKA ,  Shigeru SUGINO ,  Ryo KANAI

发明人： Nobuo TAKETOMI ,  Shunichi KIKUCHI ,  Naoki NAKAMURA ,  Kiyoyuki HATANAKA ,  Shigeru SUGINO ,  Ryo KANAI

IPC分类号： H05K5/00 ,  H05K1/00 ,  H05K1/11 ,  B29C65/02

CPC分类号： H05K3/4694 ,  H05K1/0269 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/09918 ,  H05K2201/09972 ,  H05K2203/061 ,  H05K2203/063 ,  H05K2203/167

摘要： A method for manufacturing a multilayer printed circuit board, and a printed circuit board manufactured according to the method, includes laterally-aligning a first inner substrate in which first insulation layers and first conductor layers are alternately laminated and a second inner substrate in which second insulation layers and second conductor layers are alternately laminated. The second inner substrate has a lager number of layers than the first inner substrate. The laterally-aligned first inner substrate and second inner substrate are placed between a pair of third insulation layers in a thickness direction. The pair of the third insulation layer are heated under pressure in the thickness direction. A conductor pattern is formed on surfaces of the pair of the third insulation layers.

摘要翻译： 一种制造多层印刷电路板的方法和根据该方法制造的印刷电路板，包括横向对准第一绝缘层和第一导体层交替层叠的第一内部基板和第二内部基板，其中第二绝缘层 层和第二导体层交替层叠。 第二内部衬底具有比第一内部衬底更多的层数。 横向排列的第一内部基板和第二内部基板在厚度方向上放置在一对第三绝缘层之间。 一对第三绝缘层在厚度方向上被加压。 在一对第三绝缘层的表面上形成导体图案。