发明申请
- 专利标题： Handler Attachment for Integrated Circuit Fabrication
- 专利标题（中）： 集成电路制造的处理器附件
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申请号： US12788832申请日： 2010-05-27
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公开(公告)号： US20110290402A1公开(公告)日： 2011-12-01
- 发明人: Paul Andry , Bing Dang , John Knickerbocker , Aparna Prabhakar , Peter Sorce , Robert E. Trzcinski , Cornelia K. Tsang
- 申请人： Paul Andry , Bing Dang , John Knickerbocker , Aparna Prabhakar , Peter Sorce , Robert E. Trzcinski , Cornelia K. Tsang
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： B32B33/00
- IPC分类号： B32B33/00 ; B29C65/16
摘要：
A method for attaching a handler to a wafer, the wafer comprising an integrated circuit (IC), includes forming a layer of an adhesive on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280° C.; and adhering a handler to the wafer using the layer of adhesive. A system for attaching a handler to a wafer, the wafer comprising IC, includes a layer of an adhesive located on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280° C.; and a handler adhered to the wafer using the layer of adhesive.
公开/授权文献
- US08388782B2 Handler attachment for integrated circuit fabrication 公开/授权日：2013-03-05