发明申请
- 专利标题: HEAT CONDUCTIVE ADHESIVE COMPOSITION AND HEAT CONDUCTIVE ADHESIVE SHEET
- 专利标题(中): 导热粘合剂和导热胶粘剂
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申请号: US13147124申请日: 2010-01-13
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公开(公告)号: US20110290468A1公开(公告)日: 2011-12-01
- 发明人: Junichi Nakayama , Yoshio Terada , Kenji Furuta , Takashi Wano
- 申请人: Junichi Nakayama , Yoshio Terada , Kenji Furuta , Takashi Wano
- 申请人地址: JP Ibaraki-shi, Osaka
- 专利权人: NITTO DENKO CORPORATION
- 当前专利权人: NITTO DENKO CORPORATION
- 当前专利权人地址: JP Ibaraki-shi, Osaka
- 优先权: JP2009-019959 20090130
- 国际申请: PCT/JP2010/050291 WO 20100113
- 主分类号: F28F7/00
- IPC分类号: F28F7/00 ; C09K5/00
摘要:
An object is to provide a heat conductive adhesive composition containing boron nitride particles and an acrylic polymer, which is capable of forming a molding having a good heat conductivity, and a heat conductive adhesive sheet with the heat conductive adhesive composition therein, which has a good heat conductivity and bond strength. Provided is the heat conductive adhesive composition which contains boron nitride particles and an acrylic polymer component, and the above boron nitride particles contain boron nitride particles having a particle size of 3 μm or more and 300 μm or less, wherein the boron nitride particles contain 5 to 45% by volume of boron nitride particles having a particle size of 3 μm or more and 20 μm or less, 30 to 70% by volume of boron nitride particles having a particle size of more than 20 μm and 60 μm or less, 1.0 to 40% by volume of boron nitride particles having a particle size of more than 60 μm and 300 μm or less.
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