发明申请
US20110290468A1 HEAT CONDUCTIVE ADHESIVE COMPOSITION AND HEAT CONDUCTIVE ADHESIVE SHEET 审中-公开
导热粘合剂和导热胶粘剂

HEAT CONDUCTIVE ADHESIVE COMPOSITION AND HEAT CONDUCTIVE ADHESIVE SHEET
摘要:
An object is to provide a heat conductive adhesive composition containing boron nitride particles and an acrylic polymer, which is capable of forming a molding having a good heat conductivity, and a heat conductive adhesive sheet with the heat conductive adhesive composition therein, which has a good heat conductivity and bond strength. Provided is the heat conductive adhesive composition which contains boron nitride particles and an acrylic polymer component, and the above boron nitride particles contain boron nitride particles having a particle size of 3 μm or more and 300 μm or less, wherein the boron nitride particles contain 5 to 45% by volume of boron nitride particles having a particle size of 3 μm or more and 20 μm or less, 30 to 70% by volume of boron nitride particles having a particle size of more than 20 μm and 60 μm or less, 1.0 to 40% by volume of boron nitride particles having a particle size of more than 60 μm and 300 μm or less.
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