Invention Application
US20110290552A1 METHOD AND SYSTEM FOR PACKAGING MEMS DEVICES WITH INCORPORATED GETTER
审中-公开
用于包装具有并发卡特的MEMS器件的方法和系统
- Patent Title: METHOD AND SYSTEM FOR PACKAGING MEMS DEVICES WITH INCORPORATED GETTER
- Patent Title (中): 用于包装具有并发卡特的MEMS器件的方法和系统
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Application No.: US13208218Application Date: 2011-08-11
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Publication No.: US20110290552A1Publication Date: 2011-12-01
- Inventor: Lauren Palmateer , William J. Cummings , Brian Gally , Clarence Chui , Manish Kothari
- Applicant: Lauren Palmateer , William J. Cummings , Brian Gally , Clarence Chui , Manish Kothari
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM MEMS TECHNOLOGIES, INC.
- Current Assignee: QUALCOMM MEMS TECHNOLOGIES, INC.
- Current Assignee Address: US CA San Diego
- Main IPC: H01L23/28
- IPC: H01L23/28 ; B29C65/54
Abstract:
Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.
Information query
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