发明申请
- 专利标题: METHOD FOR DAMAGE-FREE JUNCTION FORMATION
- 专利标题(中): 无损伤接头形成方法
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申请号: US12792190申请日: 2010-06-02
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公开(公告)号: US20110300696A1公开(公告)日: 2011-12-08
- 发明人: Christopher R. HATEM , Ludovic GODET
- 申请人: Christopher R. HATEM , Ludovic GODET
- 申请人地址: US MA Gloucester
- 专利权人: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
- 当前专利权人: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
- 当前专利权人地址: US MA Gloucester
- 主分类号: H01L21/26
- IPC分类号: H01L21/26
摘要:
Embodiments of this doping method may be used to improve junction formation. An implant species, such as helium or another noble gas, is implanted into a workpiece to a first depth. A dopant is deposited on a surface of the workpiece. During an anneal, the dopant diffuses to the first depth. The noble gas ions may at least partially amorphize the workpiece during the implant. The workpiece may be planar or non-planar. The implant and deposition may occur in a system without breaking vacuum.
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