Invention Application
US20110303443A1 MOUNT STRUCTURE, ELECTRONIC APPARATUS, STRESS RELIEVING UNIT, AND METHOD OF MANUFACTURING STRESS RELIEVING UNIT
审中-公开
安装结构，电子设备，应力消除单元和制造应力消除单元的方法
- Patent Title: MOUNT STRUCTURE, ELECTRONIC APPARATUS, STRESS RELIEVING UNIT, AND METHOD OF MANUFACTURING STRESS RELIEVING UNIT
- Patent Title (中): 安装结构，电子设备，应力消除单元和制造应力消除单元的方法
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Application No.: US13046821Application Date: 2011-03-14
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Publication No.: US20110303443A1Publication Date: 2011-12-15
- Inventor: Masayuki KITAJIMA , Toru OKADA , Hiroshi KOBAYASHI , Satoshi EMOTO
- Applicant: Masayuki KITAJIMA , Toru OKADA , Hiroshi KOBAYASHI , Satoshi EMOTO
- Applicant Address: JP Kawasaki-shi
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki-shi
- Priority: JP2010-133373 20100610
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/16 ; H05K3/30 ; H02G15/08
Abstract:
A mount structure for mounting an electronic component on a circuit board includes a stress relieving unit including a center portion having a smaller cross section than a cross section of ends of the stress relieving unit; a first joint portion configured to join one end of the stress relieving unit onto an electrode pad of the electronic component; a second joint portion configured to join the other end of the stress relieving unit onto a connecting pad of the circuit board. Hollow spaces are provided between plural joint structures each of which includes the first joint portion, the stress relieving unit, and the second joint portion.
Information query
