公开(公告)号：US20130087605A1

公开(公告)日：2013-04-11

申请号：US13596511

申请日：2012-08-28

Applicant: Takashi KUBOTA ,  Masayuki KITAJIMA ,  Takatoyo YAMAKAMI ,  Kuniko ISHIKAWA

Inventor： Takashi KUBOTA ,  Masayuki KITAJIMA ,  Takatoyo YAMAKAMI ,  Kuniko ISHIKAWA

IPC: B23K35/24 ,  B23K31/02

CPC classification number: B23K35/262 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/24 ,  B23K35/286 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/36 ,  B23K35/3613 ,  B23K2101/40 ,  C22C12/00 ,  C22C13/00 ,  C22C13/02 ,  H01B1/22 ,  H01L24/24 ,  H01L24/82 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/15788 ,  H01L2924/19105 ,  H05K1/0269 ,  H05K3/3463 ,  H05K2201/0272 ,  H01L2924/00

Abstract: A conductive bonding material comprising: a first metal particle; a second metal particle having an average particle diameter larger than an average particle diameter of the first metal particle; and a third metal particle having an average particle diameter larger than the average particle diameter of the first metal particle, a relative density larger than a relative density of the first metal particle, and a melting point higher than a melting point of the second metal particle.

Abstract translation: 一种导电接合材料，包括：第一金属颗粒; 平均粒径大于第一金属颗粒的平均粒径的第二金属颗粒; 和平均粒径大于第一金属粒子的平均粒径的第三金属粒子，比第一金属粒子的相对密度大的相对密度，高于第二金属粒子的熔点的熔点 。

公开(公告)号：US08314339B2

公开(公告)日：2012-11-20

申请号：US12495860

申请日：2009-07-01

Applicant: Masayuki Kitajima ,  Takeshi Ishitsuka ,  Satoshi Emoto

Inventor： Masayuki Kitajima ,  Takeshi Ishitsuka ,  Satoshi Emoto

IPC: H05K1/03 ,  H05K1/09

CPC classification number: H05K3/249 ,  H05K1/118 ,  H05K2201/0272 ,  H05K2201/035 ,  H05K2201/0769 ,  H05K2203/1105

Abstract: A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material.

Abstract translation: 印刷布线板包括形成布线图案的第一导电浆料和包含捏合的第一导电材料的第二导电浆料和其颗粒比第一导电材料细颗粒的第二导电材料。

公开(公告)号：US20110304059A1

公开(公告)日：2011-12-15

申请号：US13044608

申请日：2011-03-10

Applicant: Hiroshi KOBAYASHI ,  Toru OKADA ,  Satoshi EMOTO ,  Masayuki KITAJIMA

Inventor： Hiroshi KOBAYASHI ,  Toru OKADA ,  Satoshi EMOTO ,  Masayuki KITAJIMA

IPC: H01L23/498 ,  H05K1/00

CPC classification number: H05K3/3436 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K2201/09036 ,  H05K2201/10734 ,  H05K2203/041 ,  Y02P70/613

Abstract: A disclosed circuit board includes a substrate, a plurality of electrode pads formed on the substrate, and a groove formed between adjacent electrode pads on the substrate. Further, the electrode pads are surrounded by the groove to have an air space between the adjacent electrode pads.

Abstract translation: 所公开的电路板包括衬底，形成在衬底上的多个电极焊盘以及形成在衬底上的相邻电极焊盘之间的凹槽。 此外，电极焊盘被沟槽包围，以在相邻的电极焊盘之间具有空气空间。

公开(公告)号：US20110303443A1

公开(公告)日：2011-12-15

申请号：US13046821

申请日：2011-03-14

Applicant: Masayuki KITAJIMA ,  Toru OKADA ,  Hiroshi KOBAYASHI ,  Satoshi EMOTO

Inventor： Masayuki KITAJIMA ,  Toru OKADA ,  Hiroshi KOBAYASHI ,  Satoshi EMOTO

IPC: H05K1/09 ,  H05K1/16 ,  H05K3/30 ,  H02G15/08

CPC classification number: H05K3/3436 ,  H01L24/10 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/1012 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/81815 ,  H01L2924/01029 ,  H01L2924/351 ,  H05K1/0271 ,  H05K2201/10242 ,  H05K2201/1031 ,  H05K2201/10674 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49124 ,  H01L2924/014 ,  H01L2924/00

Abstract: A mount structure for mounting an electronic component on a circuit board includes a stress relieving unit including a center portion having a smaller cross section than a cross section of ends of the stress relieving unit; a first joint portion configured to join one end of the stress relieving unit onto an electrode pad of the electronic component; a second joint portion configured to join the other end of the stress relieving unit onto a connecting pad of the circuit board. Hollow spaces are provided between plural joint structures each of which includes the first joint portion, the stress relieving unit, and the second joint portion.

Abstract translation: 用于将电子部件安装在电路板上的安装结构包括：应力消除单元，包括具有比所述应力消除单元的端部的横截面小的横截面的中心部分; 第一接合部，其构造成将所述应力消除单元的一端接合到所述电子部件的电极焊盘上; 第二接合部，其构造成将所述应力消除单元的另一端接合到所述电路板的连接焊盘上。 在多个接头结构之间设置有空心空间，每个接头结构包括第一接头部分，应力消除单元和第二接头部分。

公开(公告)号：US07911116B2

公开(公告)日：2011-03-22

申请号：US12410131

申请日：2009-03-24

Applicant: Shunichi Aikawa ,  Masayuki Kitajima ,  Keiji Tsuda

Inventor： Shunichi Aikawa ,  Masayuki Kitajima ,  Keiji Tsuda

IPC: H03H9/25 ,  H01L41/22

CPC classification number: H03H3/02 ,  H03H9/02929 ,  H03H9/02937 ,  H03H9/02992 ,  Y10T29/42

Abstract: A surface acoustic wave device includes a piezoelectric substrate, an interdigital transducer (IDT) formed on the piezoelectric substrate, an interconnection electrode that is provided on the piezoelectric substrate and is connected to the IDT, the IDT being made of a metal identical to that of the IDT, an inorganic insulation layer that is provided on the piezoelectric substrate so that at least the interconnection electrode is exposed, an insulative resin layer that is located on an interface between the inorganic insulation layer and a portion of the interconnection electrode exposed from the inorganic insulation layer and is formed so as to cover a side surface of the interconnection electrode, and a metal layer that is provided on the interconnection electrode and the insulative resin layer.

Abstract translation: 表面声波装置包括压电基板，形成在压电基板上的叉指式换能器（IDT），配置在压电基板上并与IDT连接的互连电极，IDT由与IDT相同的金属制成 IDT是设置在压电基板上至少使互连电极露出的无机绝缘层，位于无机绝缘层与互连电极的从无机物露出的部分的界面上的绝缘性树脂层 形成为覆盖互连电极的侧面的金属层和设置在配线电极和绝缘性树脂层上的金属层。

公开(公告)号：US06744183B2

公开(公告)日：2004-06-01

申请号：US10347708

申请日：2003-01-21

Applicant: Masayuki Kitajima ,  Yutaka Noda ,  Seiichi Shimoura ,  Toru Okada ,  Masanao Fujii ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka

Inventor： Masayuki Kitajima ,  Yutaka Noda ,  Seiichi Shimoura ,  Toru Okada ,  Masanao Fujii ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka

IPC: H01L41047

CPC classification number: H01L41/29 ,  G11B5/5552 ,  G11B5/5556 ,  H01L41/0993 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01327 ,  Y10T29/42 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.

Abstract translation: 一种键合压电元件和电极的方法，包括以下步骤：在压电元件的接合表面上形成选自Au，Al，Zn，Cu和Sn的材料的第一涂层，并形成 在电极的接合表面上第二次涂覆选自Au，Al，Zn，Cu和Sn的材料。 第一和第二涂层的材料的组合优选为Au / Au，Au / Al，Zn / Cu或Sn / Cu。 该方法还包括使第一和第二涂层彼此紧密接触并在压力下加热它们以在第一和第二涂层之间形成金属键或金属间化合物，从而结合压电元件和电极的步骤。

公开(公告)号：US06495441B2

公开(公告)日：2002-12-17

申请号：US09533172

申请日：2000-03-22

Applicant: Masayuki Kitajima ,  Masakazu Takesue ,  Yoshitaka Muraoka

Inventor： Masayuki Kitajima ,  Masakazu Takesue ,  Yoshitaka Muraoka

IPC: H01L2144

CPC classification number: H01L24/13 ,  B23K1/0016 ,  B23K35/26 ,  B23K35/262 ,  B23K35/3013 ,  B23K2101/36 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/0558 ,  H01L2224/056 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/11822 ,  H01L2224/1184 ,  H01L2224/11901 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1358 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13605 ,  H01L2224/13609 ,  H01L2224/13613 ,  H01L2224/13618 ,  H01L2224/13655 ,  H01L2224/13671 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/7501 ,  H01L2224/7515 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/81011 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3436 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099

Abstract: A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.

公开(公告)号：US06428911B2

公开(公告)日：2002-08-06

申请号：US09930245

申请日：2001-08-16

Applicant: Masayuki Kitajima ,  Masakazu Takesue ,  Tadaaki Shono ,  Motoko Fujioka

Inventor： Masayuki Kitajima ,  Masakazu Takesue ,  Tadaaki Shono ,  Motoko Fujioka

IPC: B23K120

CPC classification number: B23K35/262 ,  B23K1/002 ,  B23K1/20 ,  H05K3/282 ,  H05K3/3463 ,  Y10T428/12903

Abstract: The present invention provides a soldering method and a soldered joint securing a strength of joint equivalent to soldering using a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and without causing a rise in cost. A soldering method comprising a step of covering Cu electrodes of electronic equipment by a rust-proofing coating consisting of an organic compound including N and a step of forming soldered joints on the covered Cu electrodes, by using a solder material consisting of at least 2.0 wt % and less than 3 wt % of Ag, 0.5 to 0.8 wt % of Cu, and a balance of Sn and unavoidable impurities. The solder material used in the present invention further contains not more than 3 wt % in total of at least one element selected from the group consisting of Sb, In, Au, Zn, Bi, and Al.

公开(公告)号：US06333554B1

公开(公告)日：2001-12-25

申请号：US09014981

申请日：1998-01-28

Applicant: Masayuki Kitajima ,  Masakazu Takesue ,  Yoshitaka Muraoka

Inventor： Masayuki Kitajima ,  Masakazu Takesue ,  Yoshitaka Muraoka

IPC: H01L2348

CPC classification number: H01L24/13 ,  B23K1/0016 ,  B23K35/26 ,  B23K35/262 ,  B23K35/3013 ,  B23K2101/36 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/0558 ,  H01L2224/056 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/11822 ,  H01L2224/1184 ,  H01L2224/11901 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1358 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13605 ,  H01L2224/13609 ,  H01L2224/13613 ,  H01L2224/13618 ,  H01L2224/13655 ,  H01L2224/13671 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/7501 ,  H01L2224/7515 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/81011 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3436 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099

Abstract: A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.

Abstract translation: 半导体器件包括具有电极的半导体元件和附接到电极的金属凸块。 金属凸块包括铜芯和覆盖芯的金表面层。 此外，金属凸块可以包括连接在一起的金突起元件和焊料凸块元件。

公开(公告)号：US6107181A

公开(公告)日：2000-08-22

申请号：US015265

申请日：1998-01-29

Applicant: Masayuki Kitajima ,  Yutaka Noda ,  Yoshitaka Muraoka

Inventor： Masayuki Kitajima ,  Yutaka Noda ,  Yoshitaka Muraoka

IPC: B23K26/10 ,  B23K26/38 ,  C03C15/00 ,  C03C23/00 ,  H01L21/60 ,  H01L21/68 ,  H05K3/00 ,  H05K3/34 ,  H01L21/44

CPC classification number: B23K26/10 ,  B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  C03C15/00 ,  C03C23/0025 ,  H01L21/6835 ,  H01L24/11 ,  H05K3/3478 ,  B23K2203/16 ,  B23K2203/30 ,  B23K2203/42 ,  B23K2203/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0525 ,  H05K2203/082 ,  H05K2203/107 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/0055 ,  Y10S438/963 ,  Y10T29/49144

Abstract: A method of manufacturing a template having through-holes for attracting and supporting electrically conductive balls by vacuum suction is disclosed. The through-holes are formed by etching and the side walls of the through-holes are smoothed by irradiation, with laser beams, of the side walls of the through-holes. A template and metallic bumps can be formed using this method. Alternatively, the template can be formed in a two-layered structure.