Invention Application
US20110303450A1 MOUNTING STRUCTURE, ELECTRONIC COMPONENT, CIRCUIT BOARD, BOARD ASSEMBLY, ELECTRONIC DEVICE, AND STRESS RELAXATION MEMBER
审中-公开
安装结构，电子元件，电路板，板组件，电子设备和应力松弛元件
- Patent Title: MOUNTING STRUCTURE, ELECTRONIC COMPONENT, CIRCUIT BOARD, BOARD ASSEMBLY, ELECTRONIC DEVICE, AND STRESS RELAXATION MEMBER
- Patent Title (中): 安装结构，电子元件，电路板，板组件，电子设备和应力松弛元件
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Application No.: US13071641Application Date: 2011-03-25
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Publication No.: US20110303450A1Publication Date: 2011-12-15
- Inventor: Toru OKADA , Hiroshi KOBAYASHI , Satoshi EMOTO , Masayuki KITAJIMA
- Applicant: Toru OKADA , Hiroshi KOBAYASHI , Satoshi EMOTO , Masayuki KITAJIMA
- Applicant Address: JP Kawasaki-shi
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki-shi
- Priority: JP2010-133371 20100610
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H02G15/00 ; H02G3/00
Abstract:
Disclosed is a mounting structure for mounting an electronic component on a circuit board. The mounting structure includes an interposer provided between the electronic component and the circuit board; and a plurality of spiral conductors formed in the interposer. The plurality of spiral conductors have one end thereof bonded to corresponding one of external connection terminals of the electronic component and the other end thereof bonded to corresponding one of electrodes of the electronic component.
Information query
