Invention Application
US20110304059A1 CIRCUIT BOARD, CIRCUIT BOARD ASSEMBLY, AND SEMICONDUCTOR DEVICE
审中-公开
电路板，电路板组件和半导体器件
- Patent Title: CIRCUIT BOARD, CIRCUIT BOARD ASSEMBLY, AND SEMICONDUCTOR DEVICE
- Patent Title (中): 电路板，电路板组件和半导体器件
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Application No.: US13044608Application Date: 2011-03-10
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Publication No.: US20110304059A1Publication Date: 2011-12-15
- Inventor: Hiroshi KOBAYASHI , Toru OKADA , Satoshi EMOTO , Masayuki KITAJIMA
- Applicant: Hiroshi KOBAYASHI , Toru OKADA , Satoshi EMOTO , Masayuki KITAJIMA
- Applicant Address: JP Kawasaki-shi
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki-shi
- Priority: JP2010-135116 20100614
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H05K1/00
Abstract:
A disclosed circuit board includes a substrate, a plurality of electrode pads formed on the substrate, and a groove formed between adjacent electrode pads on the substrate. Further, the electrode pads are surrounded by the groove to have an air space between the adjacent electrode pads.
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