发明申请
- 专利标题： Device For Removing Electromagnetic Interference And Semiconductor Package Including The Same
- 专利标题（中）： 用于去除电磁干扰和包括其的半导体封装的装置
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申请号： US13083931申请日： 2011-04-11
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公开(公告)号： US20110304364A1公开(公告)日： 2011-12-15
- 发明人: Jae-wook Yoo , Kyoung-sel Choi , Yun-seok Choi
- 申请人： Jae-wook Yoo , Kyoung-sel Choi , Yun-seok Choi
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Suwon-si
- 优先权： KR10-2010-0056754 20100615
- 主分类号： H03L7/08
- IPC分类号： H03L7/08 ; H05K9/00 ; H01L23/552
摘要：
Provided is an electromagnetic interference (EMI) removing device for active reduction of electromagnetic interference and a semiconductor package including the same. The EMI removing device may include a film substrate having an antenna pattern configured to generate a second electromagnetic wave, which may have substantially the same frequency band, modulation mode, and directivity as a first electromagnetic wave generated by a first semiconductor chip and a phase opposite to a phase of the first electromagnetic wave
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