Invention Application
- Patent Title: IMAGE SENSOR CHIP AND CAMERA MODULE HAVING THE SAME
- Patent Title (中): 图像传感器芯片和具有相同功能的摄像机模块
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Application No.: US13095155Application Date: 2011-04-27
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Publication No.: US20110304763A1Publication Date: 2011-12-15
- Inventor: Mi-Na Choi , Kyoung-Sei Choi , Hee-Seok Lee , Yong-Hoon Kim , Hee-Jung Hwang , Se-Ran Bae
- Applicant: Mi-Na Choi , Kyoung-Sei Choi , Hee-Seok Lee , Yong-Hoon Kim , Hee-Jung Hwang , Se-Ran Bae
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2010-0055668 20100611
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H01L31/0216
Abstract:
An image sensor chip, a camera module, and devices incorporating the image sensor chip and camera module include a light receiving unit on which light is incident, a logic unit provided to surround the light receiving unit, and an electromagnetic wave shielding layer formed on the logic unit and not formed on the light receiving unit.
Information query
