发明申请
- 专利标题: INTEGRATED CIRCUIT SYSTEM WITH RECESSED THROUGH SILICON VIA PADS AND METHOD OF MANUFACTURE THEREOF
- 专利标题(中): 集成电路系统,通过硅胶通过硅胶及其制造方法
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申请号: US12820491申请日: 2010-06-22
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公开(公告)号: US20110309492A1公开(公告)日: 2011-12-22
- 发明人: HeeJo Chi , NamJu Cho , HanGil Shin
- 申请人: HeeJo Chi , NamJu Cho , HanGil Shin
- 主分类号: H01L23/498
- IPC分类号: H01L23/498 ; H01L21/60 ; H01L21/768
摘要:
A method of manufacture of an integrated circuit system includes: providing a substrate with a face surface having a via therein and a back surface having a trench therein; filling the via with a conductive pillar; forming a recessed contact pad in the trench; filling the recessed contact pad partially with solder; and forming an under-bump metal having a base surface in electrical contact with the conductive pillar, and having sides that extend away from the face surface of the substrate and further extend beyond the base surface.