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发明申请
US20110316150A1 SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE 审中-公开
半导体封装和制造半导体封装的方法

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
摘要：
A semiconductor package includes a first board, a semiconductor chip having a first face and a second face at an opposite side to the first face, the semiconductor chip being mounted on the first board with the first face facing the first board, an insulating film provided on the second face of the semiconductor chip, and a second board stacked on the first board. A bump provided on a face of the second board facing the first board is connected to a pad provided on a face of the first board facing the second board and a gap is formed between the first board and the second board. The semiconductor chip and the insulating film are provided in the gap.
摘要（中）：

半导体封装包括第一板，具有第一面的半导体芯片和与第一面相反一侧的第二面，半导体芯片安装在第一板上，第一面朝向第一板，设置绝缘膜 在半导体芯片的第二面上，以及堆叠在第一板上的第二板。 设置在面向第一板的第二板的表面上的凸块连接到设置在面向第二板的第一板的表面上的焊盘，并且在第一板和第二板之间形成间隙。 半导体芯片和绝缘膜设置在间隙中。

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