发明申请
- 专利标题： METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND CAMERA MODULE
- 专利标题（中）： 制造半导体器件，半导体器件和相机模块的方法
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申请号： US13169548申请日： 2011-06-27
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公开(公告)号： US20110317050A1公开(公告)日： 2011-12-29
- 发明人: Takashi Shirono , Mie Matsuo , Hideo Numata , Kazumasa Tanida , Tsuyoshi Matsumura
- 申请人： Takashi Shirono , Mie Matsuo , Hideo Numata , Kazumasa Tanida , Tsuyoshi Matsumura
- 优先权： JP2010-145886 20100628
- 主分类号： H04N5/335
- IPC分类号： H04N5/335 ; H01L29/02 ; H01L21/18
摘要：
According to an embodiment, a method of manufacturing a semiconductor device includes polishing a peripheral portion of the semiconductor substrate, and forming a protective film to be an insulating film, on a surface of the semiconductor substrate including a surface exposed by the polishing.
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