发明申请
- 专利标题： SEMICONDUCTOR PACKAGE, ELECTRICAL AND ELECTRONIC APPARATUS INCLUDING THE SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
- 专利标题（中）： 包含半导体封装的半导体封装，电气和电子设备及制造半导体封装的方法
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申请号： US13041422申请日： 2011-03-06
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公开(公告)号： US20110318876A1公开(公告)日： 2011-12-29
- 发明人: Jong-gi Lee , Sang-wook Park , Ji-seok Hong
- 申请人： Jong-gi Lee , Sang-wook Park , Ji-seok Hong
- 申请人地址： KR Gyeonggi-do
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Gyeonggi-do
- 优先权： KR10-2010-0061266 20100628
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/56
摘要：
In one embodiment, a semiconductor package may include a semiconductor chip having a chip pad formed on a first surface thereof, a sealing member for sealing the semiconductor chip and exposing the first surface of the semiconductor chip, a conductive wiring overlying a part of the first surface of the semiconductor chip and directly contacting a part of an upper surface of the sealing member. The conductive wiring further contacts the pad. The semiconductor package may also include an encapsulant covering the conductive wiring and having openings for exposing parts of the conductive wiring.
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