发明申请
US20110319525A1 EPOXY RESIN COMPOSITION, PREPREG, CARBON FIBER REINFORCED COMPOSITE MATERIAL, AND HOUSING FOR ELECTRONIC OR ELECTRICAL COMPONENT 审中-公开
环氧树脂组合物,PREPREG,碳纤维增强复合材料和电子或电气部件的外壳

  • 专利标题: EPOXY RESIN COMPOSITION, PREPREG, CARBON FIBER REINFORCED COMPOSITE MATERIAL, AND HOUSING FOR ELECTRONIC OR ELECTRICAL COMPONENT
  • 专利标题(中): 环氧树脂组合物,PREPREG,碳纤维增强复合材料和电子或电气部件的外壳
  • 申请号: US13255223
    申请日: 2010-02-04
  • 公开(公告)号: US20110319525A1
    公开(公告)日: 2011-12-29
  • 发明人: Yuki MaedaShiro HondaShiori Kawamoto
  • 申请人: Yuki MaedaShiro HondaShiori Kawamoto
  • 优先权: JP2009073360 20090325
  • 国际申请: PCT/JP2010/051589 WO 20100204
  • 主分类号: C08L63/00
  • IPC分类号: C08L63/00 C08K13/02 C08K5/521 C08L71/10 C08K5/5399
EPOXY RESIN COMPOSITION, PREPREG, CARBON FIBER REINFORCED COMPOSITE MATERIAL, AND HOUSING FOR ELECTRONIC OR ELECTRICAL COMPONENT
摘要:
Provided are a carbon fiber reinforced composite material which exhibits excellent flame retardance, fast curing properties, heat resistance, and mechanical characteristics. Also provided are an epoxy resin composition suitable for use in producing said carbon fiber reinforced composite material as well as a prepreg and housing for electronic/electrical components. The epoxy resin composition is characterized by comprising: [A] an epoxy resin containing at least 50 mass % of a compound as represented by general formula (I), [B] an organic nitrogen compound based curing agent, [C] a phosphoric acid ester, and [D] a phosphazene compound. In general formula (I), R1, R2, and R3 are either a hydrogen atom or a methyl group, and n is an integer of 1 or higher.
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