发明申请
- 专利标题： Deposition Apparatus And Methods To Reduce Deposition Asymmetry
- 专利标题（中）： 沉积装置和减少沉积不对称的方法
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申请号： US13173197申请日： 2011-06-30
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公开(公告)号： US20120000772A1公开(公告)日： 2012-01-05
- 发明人: Alan Ritchie , Michael S. Cox
- 申请人： Alan Ritchie , Michael S. Cox
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 主分类号： C23C14/34
- IPC分类号： C23C14/34
摘要：
One or more embodiments of the invention are directed to deposition apparatuses comprising a grounded top wall, a processing chamber and a plasma source assembly having a conductive hollow cylinder and substantially continuous grounded shield substantially conforming to the shape of the hollow cylinder.