Invention Application
- Patent Title: WIRELESS TELEMETRY ELECTRONIC CIRCUIT BOARD FOR HIGH TEMPERATURE ENVIRONMENTS
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Application No.: US13236083Application Date: 2011-09-19
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Publication No.: US20120005891A1Publication Date: 2012-01-12
- Inventor: David J. Mitchell , Anand A. Kulkarni , Ramesh Subramanian , Edward R. Roesch , Rod Waits , Roberto Schupbach , John R. Fraley , Alexander B. Lostetter , Brice McPherson , Bryon Western
- Applicant: David J. Mitchell , Anand A. Kulkarni , Ramesh Subramanian , Edward R. Roesch , Rod Waits , Roberto Schupbach , John R. Fraley , Alexander B. Lostetter , Brice McPherson , Bryon Western
- Main IPC: H05K3/30
- IPC: H05K3/30
Abstract:
A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.
Public/Granted literature
- US08458899B2 Method for manufacturing a circuit for high temperature and high g-force environments Public/Granted day:2013-06-11
Information query
