公开(公告)号：US08525036B2

公开(公告)日：2013-09-03

申请号：US13235984

申请日：2011-09-19

申请人： David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

发明人： David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

IPC分类号： H05K1/00

CPC分类号： H05K1/092 ,  G01K1/024 ,  G01K13/02 ,  G01K2013/024 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48472 ,  H01L2224/48644 ,  H01L2924/01322 ,  H01L2924/13062 ,  H01L2924/3011 ,  H05K3/102 ,  H05K3/1291 ,  H05K3/321 ,  H05K3/328 ,  H05K2201/10674 ,  H05K2203/0186 ,  H05K2203/049 ,  H05K2203/0557 ,  H05K2203/1126 ,  H05K2203/167 ,  Y10T29/49128 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/53174 ,  Y10T428/2947 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/20751 ,  H01L2924/20752

摘要： A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.

摘要翻译： 公开了一种抵抗高温高压离心力的电路组件（34）。 印刷电路板（42）首先由氧化铝制成，并且通过使用厚膜金膏在其上形成所述电路的导电迹线。 电路组件的主动和被动部件通过在高温下扩散的金粉附着到印刷电路板上。 为了完成电路组件（34），金线用于电路迹线和有源部件之间的接合。 另外，公开了一种制造耐高温的电路组件的方法。

公开(公告)号：US08223036B2

公开(公告)日：2012-07-17

申请号：US12192324

申请日：2008-08-15

申请人： David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

发明人： David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

IPC分类号： H04Q9/00 ,  F02C6/00 ,  H03F3/04

CPC分类号： G01D3/036 ,  G01K1/024 ,  G01K1/12 ,  G01K1/20 ,  G01K2205/00 ,  G01L1/2281 ,  H03F1/306 ,  H03F2200/18 ,  H03F2200/447

摘要： In a telemetry system for use in an engine, a circuit structure (34) affixed to a moving part (20) of the engine is disposed for amplifying information sensed about a condition of the part and transmitting the sensed information to a receiver external to the engine. The circuit structure is adapted for the high temperature environment of the engine and includes a differential amplifier (102, 111) having an input for receiving a signal from a sensor (101, 110) disposed on the part. A voltage controlled oscillator (104, 115) with an input coupled to the output of the amplifier produces an oscillatory signal having a frequency representative of the sensed condition. A buffer (105, 116) with an input coupled to the output of the oscillator buffers the oscillatory signal, which is then coupled to an antenna (26) for transmitting the information to the receiver.

摘要翻译： 在用于发动机的遥测系统中，固定在发动机的运动部分（20）上的电路结构（34）被设置用于放大关于部件的状况的感测信息，并将感测到的信息传送到 发动机。 电路结构适用于发动机的高温环境，并且包括具有用于从设置在该部件上的传感器（101,110）接收信号的输入的差分放大器（102,111）。 具有耦合到放大器的输出的输入端的压控振荡器（104,115）产生具有表示感测状态的频率的振荡信号。 具有耦合到振荡器的输出的输入端的缓冲器（105,116）缓冲振荡信号，然后振荡信号被耦合到用于将信息发送到接收器的天线（26）。

公开(公告)号：US08410600B2

公开(公告)日：2013-04-02

申请号：US12876614

申请日：2010-09-07

申请人： Alexander B. Lostetter ,  Jared Hornberger ,  Takukazu Otsuka

发明人： Alexander B. Lostetter ,  Jared Hornberger ,  Takukazu Otsuka

IPC分类号： H01L29/41

CPC分类号： H01L21/84 ,  H01L21/0485 ,  H01L21/6715 ,  H01L24/24 ,  H01L29/66068 ,  H01L2224/24998 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/00

摘要： Provided are a semiconductor device and a method of fabricating the semiconductor device, the semiconductor device including: a source trace, a drain trace, and a gate trace placed on a substrate; a transistor which is placed on the drain trace and includes a source pad and a gate pad; insulating films placed between the drain and source traces and between the drain and gate traces on the substrate so as to cover sidewall surfaces of the transistor; a source spray electrode which is placed on the insulating film between the source and drain traces and connects the source pad of the transistor and the source trace; and a gate spray electrode placed on the insulating film between the gate and drain traces and connects the gate pad of the transistor and the gate trace.

摘要翻译： 提供半导体器件和制造半导体器件的方法，该半导体器件包括：源极迹线，漏极迹线和置于衬底上的栅极迹线; 放置在漏极迹线上并包括源极焊盘和栅极焊盘的晶体管; 绝缘膜放置在漏极和源极之间以及衬底上的漏极和栅极迹线之间，以覆盖晶体管的侧壁表面; 源极喷射电极，放置在源极和漏极迹线之间的绝缘膜上，并连接晶体管的源极焊盘和源极迹线; 以及栅极喷射电极，其放置在栅极和漏极迹线之间的绝缘膜上，并连接晶体管的栅极焊盘和栅极迹线。

公开(公告)号：US08220990B2

公开(公告)日：2012-07-17

申请号：US12192280

申请日：2008-08-15

申请人： David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

发明人： David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

IPC分类号： H05K1/14

CPC分类号： H04Q9/00 ,  G01D11/24 ,  H04Q2209/40 ,  H04Q2209/80

摘要： A circuit assembly (34) affixed to a moving part (20) of a turbine for receiving information about a condition of the part and transmitting this information external to the engine. The circuit assembly includes a high-temperature resistant package (34A) that attaches to the part. A high temperature resistant PC board (42) supports both active and passive components of the circuit, wherein a first group of the passive components are fabricated with zero temperature coefficient of resistance and a second group of the passive components are fabricated with a positive temperature coefficient of resistance. The active components are fabricated with high temperature metallization. Connectors (40) attached to the PC board pass through a wall of the package (34A) for communication with sensors (30) on the part and with an antenna (26) for transmitting data about the condition of the part to outside the turbine.

摘要翻译： 固定到涡轮机的运动部件（20）的电路组件（34），用于接收关于部件的状况的信息并将该信息发送到发动机外部。 电路组件包括附接到该部件的耐高温封装（34A）。 耐高温PC板（42）支持电路的有源和无源部件，其中第一组无源部件被制造成具有零温度电阻系数，并且第二组无源部件以正温度系数 的阻力。 活性组分用高温金属化制成。 连接到PC板的连接器（40）穿过封装的墙壁（34A），用于与部件上的传感器（30）通信，以及用于将关于部件的状况的数据传输到涡轮机外部的天线（26）。

公开(公告)号：US20100039289A1

公开(公告)日：2010-02-18

申请号：US12192280

申请日：2008-08-15

申请人： David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

发明人： David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

IPC分类号： G08C19/00

CPC分类号： H04Q9/00 ,  G01D11/24 ,  H04Q2209/40 ,  H04Q2209/80

摘要： A circuit assembly (34) affixed to a moving part (20) of a turbine for receiving information about a condition of the part and transmitting this information external to the engine. The circuit assembly includes a high-temperature resistant package (34A) that attaches to the part. A high temperature resistant PC board (42) supports both active and passive components of the circuit, wherein a first group of the passive components are fabricated with zero temperature coefficient of resistance and a second group of the passive components are fabricated with a positive temperature coefficient of resistance. The active components are fabricated with high temperature metallization. Connectors (40) attached to the PC board pass through a wall of the package (34A) for communication with sensors (30) on the part and with an antenna (26) for transmitting data about the condition of the part to outside the turbine.

摘要翻译： 固定到涡轮机的运动部件（20）的电路组件（34），用于接收关于部件的状况的信息并将该信息发送到发动机外部。 电路组件包括附接到该部件的耐高温封装（34A）。 耐高温PC板（42）支持电路的有源和无源部件，其中第一组无源部件被制造成具有零温度电阻系数，并且第二组无源部件以正温度系数 的阻力。 活性组分用高温金属化制成。 连接到PC板的连接器（40）穿过封装的墙壁（34A），用于与部件上的传感器（30）通信，以及用于将关于部件的状况的数据传输到涡轮机外部的天线（26）。

公开(公告)号：US20100039288A1

公开(公告)日：2010-02-18

申请号：US12192366

申请日：2008-08-15

申请人： DAVID J. MITCHELL ,  ANAND A. KULKARNI ,  RAMESH SUBRAMANIAN ,  EDWARD R. ROESCH ,  ROD WAITS ,  ROBERTO SCHUPBACH ,  JOHN R. FRALEY ,  ALEXANDER B. LOSTETTER ,  BRICE MCPHERSON ,  BRYON WESTERN

发明人： DAVID J. MITCHELL ,  ANAND A. KULKARNI ,  RAMESH SUBRAMANIAN ,  EDWARD R. ROESCH ,  ROD WAITS ,  ROBERTO SCHUPBACH ,  JOHN R. FRALEY ,  ALEXANDER B. LOSTETTER ,  BRICE MCPHERSON ,  BRYON WESTERN

IPC分类号： G08C19/02 ,  G01K7/02 ,  G01K7/34

CPC分类号： H04Q9/00 ,  G01K1/024 ,  G01K1/026 ,  G01K7/021 ,  G01K7/13 ,  G01K7/34 ,  G01K13/08 ,  H04Q2209/40

摘要： A circuit affixed to a moving part of an engine for sensing and processing the temperature of the part. The circuit generates a signal representative of the temperature sensed by a thermocouple (110) and amplified by an amplifier (112). A square wave oscillator (113) with a temperature sensitive capacitor (C8) varies its frequency in response to changes of a local temperature of the circuit. A chopper (114, J27) converts the output of the amplifier into an alternating current signal. The chopper is gated by the square wave oscillator and a second input is coupled to an output of the amplifier. Thus, the chopper has an output signal having a frequency representative of the local temperature and an amplitude representative of the thermocouple temperature, whereby the combined signals represent the true temperature of the part.

摘要翻译： 固定在发动机运动部分的电路，用于检测和处理部件的温度。 电路产生代表由热电偶（110）感测并由放大器（112）放大的温度的信号。 具有温度敏感电容器（C8）的方波振荡器（113）响应于电路的局部温度的变化而改变其频率。 斩波器（114，J27）将放大器的输出转换为交流信号。 斩波器由方波振荡器门控，第二输入端连接到放大器的输出端。 因此，斩波器具有表示局部温度的频率的输出信号和表示热电偶温度的振幅，由此组合的信号表示部件的真实温度。

公开(公告)号：US08458899B2

公开(公告)日：2013-06-11

申请号：US13236083

申请日：2011-09-19

申请人： David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

发明人： David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

IPC分类号： H05K3/20

CPC分类号： H05K1/092 ,  G01K1/024 ,  G01K13/02 ,  G01K2013/024 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48472 ,  H01L2224/48644 ,  H01L2924/01322 ,  H01L2924/13062 ,  H01L2924/3011 ,  H05K3/102 ,  H05K3/1291 ,  H05K3/321 ,  H05K3/328 ,  H05K2201/10674 ,  H05K2203/0186 ,  H05K2203/049 ,  H05K2203/0557 ,  H05K2203/1126 ,  H05K2203/167 ,  Y10T29/49128 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/53174 ,  Y10T428/2947 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/20751 ,  H01L2924/20752

摘要： A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.

摘要翻译： 公开了一种抵抗高温高压离心力的电路组件（34）。 印刷电路板（42）首先由氧化铝制成，并且通过使用厚膜金膏在其上形成所述电路的导电迹线。 电路组件的主动和被动部件通过在高温下扩散的金粉附着到印刷电路板上。 为了完成电路组件（34），金线用于电路迹线和有源部件之间的接合。 另外，公开了一种制造耐高温的电路组件的方法。

公开(公告)号：US20120256761A1

公开(公告)日：2012-10-11

申请号：US13526933

申请日：2012-06-19

申请人： DAVID J. MITCHELL ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice Mcpherson ,  Bryon Westen

发明人： DAVID J. MITCHELL ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice Mcpherson ,  Bryon Westen

IPC分类号： G08C15/06

CPC分类号： G01D3/036 ,  G01K1/024 ,  G01K1/12 ,  G01K1/20 ,  G01K2205/00 ,  G01L1/2281 ,  H03F1/306 ,  H03F2200/18 ,  H03F2200/447

摘要： In a telemetry system for use in an engine, a circuit structure (34) affixed to a moving part (20) of the engine is disposed for amplifying information sensed about a condition of the part and transmitting the sensed information to a receiver external to the engine. The circuit structure is adapted for the high temperature environment of the engine and includes a differential amplifier (102, 111) having an input for receiving a signal from a sensor (101, 110) disposed on the part. A voltage controlled oscillator (104, 115) with an input coupled to the output of the amplifier produces an oscillatory signal having a frequency representative of the sensed condition. A buffer (105, 116) with an input coupled to the output of the oscillator buffers the oscillatory signal, which is then coupled to an antenna (26) for transmitting the information to the receiver.

摘要翻译： 在用于发动机的遥测系统中，固定在发动机的运动部分（20）上的电路结构（34）被设置用于放大关于部件的状况的感测信息，并将感测到的信息传送到 发动机。 电路结构适用于发动机的高温环境，并且包括具有用于从设置在该部件上的传感器（101,110）接收信号的输入的差分放大器（102,111）。 具有耦合到放大器的输出的输入端的压控振荡器（104,115）产生具有表示感测状态的频率的振荡信号。 具有耦合到振荡器的输出的输入端的缓冲器（105,116）缓冲振荡信号，然后振荡信号被耦合到用于将信息发送到接收器的天线（26）。

公开(公告)号：US08092080B2

公开(公告)日：2012-01-10

申请号：US12192366

申请日：2008-08-15

申请人： David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

发明人： David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

IPC分类号： G01K1/00

CPC分类号： H04Q9/00 ,  G01K1/024 ,  G01K1/026 ,  G01K7/021 ,  G01K7/13 ,  G01K7/34 ,  G01K13/08 ,  H04Q2209/40

摘要： A circuit affixed to a moving part of an engine for sensing and processing the temperature of the part. The circuit generates a signal representative of the temperature sensed by a thermocouple (110) and amplified by an amplifier (112). A square wave oscillator (113) with a temperature sensitive capacitor (C8) varies its frequency in response to changes of a local temperature of the circuit. A chopper (114, J27) converts the output of the amplifier into an alternating current signal. The chopper is gated by the square wave oscillator and a second input is coupled to an output of the amplifier. Thus, the chopper has an output signal having a frequency representative of the local temperature and an amplitude representative of the thermocouple temperature, whereby the combined signals represent the true temperature of the part.

摘要翻译： 固定在发动机运动部分的电路，用于检测和处理部件的温度。 电路产生代表由热电偶（110）感测并由放大器（112）放大的温度的信号。 具有温度敏感电容器（C8）的方波振荡器（113）响应于电路的局部温度的变化而改变其频率。 斩波器（114，J27）将放大器的输出转换为交流信号。 斩波器由方波振荡器门控，第二输入端连接到放大器的输出端。 因此，斩波器具有表示局部温度的频率的输出信号和表示热电偶温度的振幅，由此组合的信号表示部件的真实温度。

公开(公告)号：US08023269B2

公开(公告)日：2011-09-20

申请号：US12192340

申请日：2008-08-15

申请人： David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

发明人： David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

IPC分类号： H05K1/14

CPC分类号： H05K1/092 ,  G01K1/024 ,  G01K13/02 ,  G01K2013/024 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48472 ,  H01L2224/48644 ,  H01L2924/01322 ,  H01L2924/13062 ,  H01L2924/3011 ,  H05K3/102 ,  H05K3/1291 ,  H05K3/321 ,  H05K3/328 ,  H05K2201/10674 ,  H05K2203/0186 ,  H05K2203/049 ,  H05K2203/0557 ,  H05K2203/1126 ,  H05K2203/167 ,  Y10T29/49128 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/53174 ,  Y10T428/2947 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/20751 ,  H01L2924/20752

摘要： A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.

摘要翻译： 公开了一种抵抗高温高压离心力的电路组件（34）。 印刷电路板（42）首先由氧化铝制成，并且通过使用厚膜金膏在其上形成所述电路的导电迹线。 电路组件的主动和被动部件通过在高温下扩散的金粉附着到印刷电路板上。 为了完成电路组件（34），金线用于电路迹线和有源部件之间的接合。 另外，公开了一种制造耐高温的电路组件的方法。