Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND PACKAGE
- Patent Title (中): 半导体器件和封装
-
Application No.: US13168107Application Date: 2011-06-24
-
Publication No.: US20120007236A1Publication Date: 2012-01-12
- Inventor: Jin Ho BAE
- Applicant: Jin Ho BAE
- Applicant Address: KR Icheon-si
- Assignee: HYNIX SEMICONDUCTOR INC.
- Current Assignee: HYNIX SEMICONDUCTOR INC.
- Current Assignee Address: KR Icheon-si
- Priority: KR10-2010-0066041 20100708
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/48
Abstract:
A semiconductor device includes a semiconductor substrate having an upper surface, a lower surface, a first side and a second side, wherein the lower surface has a slope so that the first side is thicker than the second side, and a circuit pattern including a bonding pad on the upper surface of the semiconductor substrate.
Public/Granted literature
- US08410603B2 Semiconductor device and package Public/Granted day:2013-04-02
Information query
IPC分类:
