公开(公告)号：US20230277414A1

公开(公告)日：2023-09-07

申请号：US18016458

申请日：2021-07-05

Applicant: Young Hee KANG ,  Jin Ho BAE

Inventor： Young Hee KANG ,  Jin Ho BAE

IPC: A61H39/04

CPC classification number: A61H39/04

Abstract: The present invention relates to an acupressure tool, and in particular, an acupressure tool in which one end of a rod-shaped acupressure body is bent toward one direction to form a first pressing part so that the acupuncture point located deeply in a human body can be easily stimulated even with a small force, and the first pressing part is formed to gradually decrease in width toward a tip, and is able to press an acupuncture point through the first pressing part on the principle of a lever.

公开(公告)号：US08846444B2

公开(公告)日：2014-09-30

申请号：US13228591

申请日：2011-09-09

Applicant: Jin Ho Bae

Inventor： Jin Ho Bae

IPC: H01L21/00 ,  H01L21/44 ,  H01L23/14 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L24/75 ,  H01L21/4803 ,  H01L21/486 ,  H01L23/145 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2924/0001 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10161 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01046 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2924/00012

Abstract: A semiconductor package includes a semiconductor chip having a first surface, on which an electrode pad is arranged, and a second surface which is the other side of the semiconductor chip, an insulation member formed on the second surface of the semiconductor chip, and comprising a via hole at a position spaced apart from the semiconductor chip, and a conductive filler filling the via hole.

Abstract translation: 半导体封装包括具有布置有电极焊盘的第一表面和作为半导体芯片的另一侧的第二表面的半导体芯片，形成在半导体芯片的第二表面上的绝缘构件，并且包括 在与半导体芯片间隔开的位置处的通孔以及填充通孔的导电填料。

公开(公告)号：US08410603B2

公开(公告)日：2013-04-02

申请号：US13168107

申请日：2011-06-24

Applicant: Jin Ho Bae

Inventor： Jin Ho Bae

IPC: H01L23/48

CPC classification number: H01L23/498 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device includes a semiconductor substrate having an upper surface, a lower surface, a first side and a second side, wherein the lower surface has a slope so that the first side is thicker than the second side, and a circuit pattern including a bonding pad on the upper surface of the semiconductor substrate.

Abstract translation: 半导体器件包括具有上表面，下表面，第一侧和第二侧的半导体衬底，其中下表面具有斜面，使得第一侧比第二侧厚;以及电路图案，包括接合 衬垫在半导体衬底的上表面上。

公开(公告)号：US20120217637A1

公开(公告)日：2012-08-30

申请号：US13465274

申请日：2012-05-07

Applicant: Woong Sun LEE ,  Qwan Ho CHUNG ,  Il Hwan CHO ,  Sang Joon LIM ,  Jong Woo YOO ,  Jin Ho BAE ,  Seung Hyun LEE

Inventor： Woong Sun LEE ,  Qwan Ho CHUNG ,  Il Hwan CHO ,  Sang Joon LIM ,  Jong Woo YOO ,  Jin Ho BAE ,  Seung Hyun LEE

IPC: H01L23/48

CPC classification number: H01L23/5384 ,  H01L23/5386 ,  H01L24/29 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83007 ,  H01L2224/83138 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The substrate for a semiconductor package includes a substrate body having a first surface and a second surface opposite to the first surface. Connection pads are formed near an edge of the first surface. Signal lines having conductive vias and first, second, and third line parts are formed. The first line parts are formed on the first surface and are connected to the connection pads and the conductive vias, which pass through the substrate body. The second line parts are formed on the first surface and connect to the conductive vias. The third line parts are formed on the second surface and connect to the conductive vias. The second and third line parts are formed to have substantially the same length. The semiconductor package utilizes the above substrate for processing data at a high speed.

Abstract translation: 用于半导体封装的衬底包括具有第一表面和与第一表面相对的第二表面的衬底本体。 在第一表面的边缘附近形成连接垫。 形成具有导电通孔和第一，第二和第三线部分的信号线。 第一线部分形成在第一表面上并且连接到穿过基板主体的连接焊盘和导电通孔。 第二线部分形成在第一表面上并连接到导电通孔。 第三线部分形成在第二表面上并连接到导电通孔。 第二和第三线部分形成为具有基本相同的长度。 半导体封装利用上述基板高速处理数据。

公开(公告)号：US20120091584A1

公开(公告)日：2012-04-19

申请号：US12981329

申请日：2010-12-29

Applicant: Ki Young KIM ,  Qwan Ho CHUNG ,  Sung Ho HYUN ,  Myung Gun PARK ,  Jin Ho BAE

Inventor： Ki Young KIM ,  Qwan Ho CHUNG ,  Sung Ho HYUN ,  Myung Gun PARK ,  Jin Ho BAE

IPC: H01L23/48

CPC classification number: H01L24/13 ,  H01L23/3128 ,  H01L24/05 ,  H01L24/14 ,  H01L24/16 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02377 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/05567 ,  H01L2224/13006 ,  H01L2224/13008 ,  H01L2224/13012 ,  H01L2224/13015 ,  H01L2224/13016 ,  H01L2224/13019 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13193 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14155 ,  H01L2224/14156 ,  H01L2224/16059 ,  H01L2224/1607 ,  H01L2224/16105 ,  H01L2224/16106 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A bump for a semiconductor package includes: a first bump formed on a semiconductor chip and having at least two land parts and a connection part which connects the land parts and has a line width smaller than the land parts; and a second bump formed on the first bump and projecting on the land parts of the first bump in shapes of a hemisphere.

Abstract translation: 半导体封装的凸块包括：形成在半导体芯片上并具有至少两个焊盘部分的第一凸块和连接焊盘部分并且具有小于焊盘部分的线宽的连接部分; 以及形成在所述第一凸块上并且以半球形状突出在所述第一凸块的所述陆部上的第二凸块。

公开(公告)号：US20120061843A1

公开(公告)日：2012-03-15

申请号：US13228591

申请日：2011-09-09

Applicant: Jin Ho BAE

Inventor： Jin Ho BAE

IPC: H01L23/48 ,  H01L21/60

CPC classification number: H01L24/75 ,  H01L21/4803 ,  H01L21/486 ,  H01L23/145 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2924/0001 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10161 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01046 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2924/00012

Abstract: A semiconductor package includes a semiconductor chip having a first surface, on which an electrode pad is arranged, and a second surface which is the other side of the semiconductor chip, an insulation member formed on the second surface of the semiconductor chip, and comprising a via hole at a position spaced apart from the semiconductor chip, and a conductive filler filling the via hole.

Abstract translation: 半导体封装包括具有布置有电极焊盘的第一表面和作为半导体芯片的另一侧的第二表面的半导体芯片，形成在半导体芯片的第二表面上的绝缘构件，并且包括 在与半导体芯片间隔开的位置处的通孔以及填充通孔的导电填料。

公开(公告)号：US20090078297A1

公开(公告)日：2009-03-26

申请号：US11858207

申请日：2007-09-20

Applicant: Jin-Ho BAE

Inventor： Jin-Ho BAE

IPC: E04H15/32

CPC classification number: E04H15/48

Abstract: The present invention provides an automatic control device of foldable tent connecting to several roof strut sets consisting of several segments serially connected in radial; wherein, said control device is typically comprised of a central standing base containing a sliding hub, a spring and a tappet roller at inside; said tappet roller is fit in the inside of the sliding hub, and is touched against with one end of said spring axially, another end of said spring is touched against the top inside surface of said central standing base; said sliding hub is connected to connectors in radial respectively and pivotally; said connectors are respectively pivoted on the rim of said central standing base at the middle points, another ends of said connectors are individually connected to the roof strut sets; on the other hand, there are several locking pins built upon the inside of the central standing base for engaging with said tappet roller, coordinating to those said tappet roller has proper number of beveled surfaces for the locking pins pushing to roll, and proper number of catching slots for locking up the locking pins. Cooperating to an extra force exerting on the central standing base to press it down relative to the roof strut sets, the sliding hub brings the tappet roller continuously to go down and up, by means of the special design between the spring and all the pushing lugs and hook slots of the tappet roller, positioning the sliding hub with the locking pin of the central standing base can be carried out, so that the tent can be opened and kept in open configuration automatically; when repeatedly press down the central standing base relative to the roof strut sets, the tent can be closed.

Abstract translation: 本发明提供一种可折叠帐篷的自动控制装置，其连接到由径向串联连接的若干段组成的多个屋顶支柱组合; 其特征在于，所述控制装置通常包括在内部包含滑动轮毂，弹簧和挺杆滚子的中心立场底座; 所述挺杆辊配合在滑动轮毂的内侧，并且轴向地与所述弹簧的一端接触，所述弹簧的另一端与所述中央站立底座的顶部内表面接触; 所述滑动毂分别以径向方式连接到连接器; 所述连接器分别在中点处在所述中心立场的边缘上枢转，所述连接器的另一端分别连接到屋顶支柱组; 另一方面，在中心站立底座的内侧形成有几个锁定销，用于与所述挺杆辊接合，与所述挺杆辊协调，所述挺针滚子具有适当数量的用于推动锁定销的倾斜表面，并且适当数量的 用于锁定锁定销的卡槽。 在中央站立基座上施加额外的力量，相对于屋顶撑杆组将其压下来，滑动轮毂通过弹簧和所有推动凸耳之间的特殊设计，连续地向上和向下移动挺杆滚筒 和挺杆滚子的钩槽，可以执行将滑动毂与中央站立基座的锁定销定位，使帐篷自动打开并保持打开状态; 当反复按压中心站立基座相对于屋顶支柱时，帐篷可以关闭。

公开(公告)号：US20120074529A1

公开(公告)日：2012-03-29

申请号：US12981112

申请日：2010-12-29

Applicant: Ki-Young KIM ,  Myung-Geun PARK ,  Jin-Ho BAE

Inventor： Ki-Young KIM ,  Myung-Geun PARK ,  Jin-Ho BAE

IPC: H01L29/41 ,  H01L21/58

CPC classification number: H01L25/0657 ,  B82Y10/00 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/53276 ,  H01L24/29 ,  H01L24/32 ,  H01L25/50 ,  H01L2221/1094 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/29007 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2225/06541 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00

Abstract: A semiconductor package may include a substrate with a first surface over which bond fingers are formed. At least two semiconductor chips may be stacked on the first surface of the substrate and each chip may have via holes. The semiconductor chips may be stacked such that the respective via holes expose the respective bond fingers of the substrate. Through electrodes may be formed in the via holes. The through electrodes may comprise carbon nanotubes grown from the exposed bond fingers of the substrate, where the through electrodes may be electrically connected with the semiconductor chips.

Abstract translation: 半导体封装可以包括具有第一表面的衬底，在该第一表面上形成结合指状物。 至少两个半导体芯片可以堆叠在基板的第一表面上，并且每个芯片可以具有通孔。 半导体芯片可以被堆叠，使得各个通孔露出基板的各个键合指状物。 通孔可以形成在通孔中。 贯通电极可以包括从衬底的暴露的结合指状物生长的碳纳米管，其中贯通电极可以与半导体芯片电连接。

公开(公告)号：US20110309504A1

公开(公告)日：2011-12-22

申请号：US13118714

申请日：2011-05-31

Applicant: Jin Ho BAE ,  Qwan Ho CHUNG ,  Woong Sun LEE

Inventor： Jin Ho BAE ,  Qwan Ho CHUNG ,  Woong Sun LEE

IPC: H01L23/48

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L24/82 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

Abstract: A stack package includes a core layer having a first surface and a second surface, and including first circuit wiring lines; a first semiconductor device disposed on the second surface of the core layer; a first resin layer formed on the second surface of the core layer to cover the first semiconductor device; second circuit wiring lines formed on the first resin layer and electrically connected with the first semiconductor device; a second semiconductor device disposed over the first resin layer including the second circuit wiring lines and electrically connected with the second circuit wiring lines; a second resin layer formed on the second circuit wiring lines and the first resin layer to cover the second semiconductor device; and a plurality of via patterns formed to pass through the first resin layer and the core layer and electrically connecting the first circuit wiring lines and the second circuit wiring lines.

Abstract translation: 堆叠包括具有第一表面和第二表面的芯层，并且包括第一电路布线; 设置在所述芯层的第二表面上的第一半导体器件; 形成在所述芯层的第二表面上以覆盖所述第一半导体器件的第一树脂层; 形成在第一树脂层上并与第一半导体器件电连接的第二电路布线; 设置在包括第二电路布线的第一树脂层上并与第二电路布线电连接的第二半导体装置; 第二树脂层，形成在第二电路布线和第一树脂层上以覆盖第二半导体器件; 以及形成为穿过第一树脂层和芯层并且电连接第一电路布线和第二电路布线的多个通孔图案。

公开(公告)号：US08069872B2

公开(公告)日：2011-12-06

申请号：US11858207

申请日：2007-09-20

Applicant: Jin-Ho Bae

Inventor： Jin-Ho Bae

IPC: E04H15/48

CPC classification number: E04H15/48

Abstract: The present invention provides an automatic control device of foldable tent connecting to several roof strut sets wherein, said control device is of a central standing base containing a sliding hub, a spring and a tappet roller at inside. Cooperating to an extra force exerting on the central standing base to press it down relative to the roof strut sets, the sliding hub brings the tappet roller continuously to go down and up, by means of the special design between the spring and all the pushing lugs and hook slots of the tappet roller, positioning the sliding hub with the locking pin of the central standing base can be carried out, so that the tent can be opened and kept in open configuration automatically; when repeatedly press down the central standing base relative to the roof strut sets, the tent can be closed.

Abstract translation: 本发明提供了一种可折叠帐篷的自动控制装置，其连接到多个屋顶支柱组件，其中，所述控制装置是一个包含内部的滑动轮毂，弹簧和挺杆辊的中心立场底座。 在中央站立基座上施加额外的力量，相对于屋顶撑杆组将其压下来，滑动轮毂通过弹簧和所有推动凸耳之间的特殊设计，连续地向上和向下移动挺杆滚筒 和挺杆滚子的钩槽，可以执行将滑动毂与中央站立基座的锁定销定位，使帐篷自动打开并保持打开状态; 当反复按压中心站立基座相对于屋顶支柱时，帐篷可以关闭。