发明申请
- 专利标题： Module and portable terminal
- 专利标题（中）： 模块和便携式终端
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申请号： US13067203申请日： 2011-05-17
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公开(公告)号： US20120008288A1公开(公告)日： 2012-01-12
- 发明人: Sotaro Tsukamoto , Eigo Inagaki
- 申请人： Sotaro Tsukamoto , Eigo Inagaki
- 申请人地址： JP Tokyo
- 专利权人： Sony Corportation
- 当前专利权人： Sony Corportation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2010-155903 20100708
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H05K5/00
摘要：
Disclosed herein is a module, including: a circuit board; electronic components mounted on the circuit board; a mold resin that insulates and seals the electronic components; a shield conducting film that covers the outside of the mold resin; and shield conducting walls which are so formed in the mold resin as to divide the mold resin into a plurality of regions.