公开(公告)号：US20050052329A1

公开(公告)日：2005-03-10

申请号：US10926315

申请日：2004-08-26

申请人： Sotaro Tsukamoto

发明人： Sotaro Tsukamoto

IPC分类号： H04B1/38 ,  H01Q1/24 ,  H01Q13/10 ,  H01Q13/16

CPC分类号： H01Q1/243 ,  H01Q13/10

摘要： A wireless communication apparatus having a metal housing is provided, in which an outside antenna is not required and a small antenna the sensitivity of which does not decrease is included. A slit 1 is provided on a metal housing 5 of a wireless communication apparatus and a feeder 2 is connected to a position approximately three-quarters of the long side of the slit 1 to be used as a ⅜λ slit antenna.

摘要翻译： 提供了一种具有金属外壳的无线通信装置，其中不需要外部天线，并且包括其灵敏度不降低的小天线。 狭缝1设置在无线通信装置的金属外壳5上，馈线2连接到狭缝1的长边的大约四分之三的位置，用作3 /8λ狭缝天线。

公开(公告)号：US20120005497A1

公开(公告)日：2012-01-05

申请号：US13064751

申请日：2011-04-13

申请人： Sotaro Tsukamoto ,  Atsuhiro Harada ,  Makoto Ueda

发明人： Sotaro Tsukamoto ,  Atsuhiro Harada ,  Makoto Ueda

IPC分类号： G06F9/44 ,  G06F1/26

CPC分类号： G06F8/654

摘要： A terminal apparatus updating method is disclosed which includes: performing a wireless power supply process of wirelessly supplying power to a terminal apparatus equipped with a wireless power reception portion so as to start up the terminal apparatus thus powered; performing a wireless transmission process of wirelessly transmitting firmware write data to the terminal apparatus started up in the wireless power supply process using a suitable wireless communication function; performing a write process of causing the terminal apparatus having received the firmware write data in the wireless transmission process to write the firmware write data to a storage portion inside the terminal apparatus; and stopping the wireless power supply process upon determination that the write process is completed.

摘要翻译： 公开了一种终端装置更新方法，其包括：对配备有无线电力接收部的终端装置进行无线供电的无线供电处理，以启动由此供电的终端装置; 执行使用合适的无线通信功能在无线电源处理中启动的无线传输固件写入数据到终端设备的无线传输过程; 在无线发送处理中执行使接收到固件写入数据的终端装置的写入处理将固件写入数据写入到终端装置内的存储部分; 并且在确定写入处理完成后停止无线供电处理。

公开(公告)号：US07122881B2

公开(公告)日：2006-10-17

申请号：US10807195

申请日：2004-03-24

申请人： Sotaro Tsukamoto ,  Satoru Kuromiya ,  Nobuhiro Hanai ,  Masato Hayashida

发明人： Sotaro Tsukamoto ,  Satoru Kuromiya ,  Nobuhiro Hanai ,  Masato Hayashida

IPC分类号： H01L23/552 ,  H01L39/00 ,  H01L29/00

CPC分类号： H01L23/552 ,  H01L23/49805 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/185 ,  H05K2201/09609 ,  H01L2224/05599

摘要： A wiring board houses a bare radio-frequency IC. Shield wiring films are provided above and below the IC. A plurality of shield interlayer-connection conductor films, i.e., shield via-holes, is provided so as to surround the IC. The shield wiring films and the shield interlayer-connection conductor films define a shield cage, which can electrostatically shield the IC. Thus, there is no need to attach a shield cap.

摘要翻译： 接线板上装有裸露的射频IC。 在IC上方和下方提供屏蔽布线膜。 提供多个屏蔽层间连接导体膜，即屏蔽通孔，以便围绕IC。 屏蔽布线膜和屏蔽层间连接导体膜限定了可以静电屏蔽IC的屏蔽笼。 因此，不需要附加屏蔽盖。

公开(公告)号：US5479138A

公开(公告)日：1995-12-26

申请号：US364041

申请日：1994-12-27

申请人： Masao Kuroda ,  Sotaro Tsukamoto ,  Susumu Wakamatsu ,  Ryuji Imai

发明人： Masao Kuroda ,  Sotaro Tsukamoto ,  Susumu Wakamatsu ,  Ryuji Imai

IPC分类号： H01P3/08 ,  H05K1/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46

CPC分类号： H01P3/088 ,  H05K1/0253 ,  H05K1/0224 ,  H05K1/0298 ,  H05K2201/09681 ,  H05K3/0005

摘要： In a multi-layer wiring board having a strip line structure in which a grounding conductor wiring and a signal circuit wiring are disposed by interposing therebetween an insulation layer, the grounding conductor wiring is in the form of a grid and an open area ratio Rx [%]of the grid and a line width ratio Ry=Wg/Ws have a relationship expressed by Ry, .ltoreq.25.98.times.Rx.sup.-0.3871 -4.370 where Wg is the line width of the grounding conductor wiring, Sg is the width of an opening of the grid, Ws is the line width of the signal circuit wiring, and Rx={Sg/(Wg+Sg)}.sup.2 .times.100.

摘要翻译： 在具有带状结构的多层布线板中，其中接地导体布线和信号电路布线之间设置有绝缘层，所述接地导体布线为格栅形式，开口面积比Rx [ ％]，线宽比Ry = Wg / Ws具有由Ry表示的关系，其中Wg是接地导体布线的线宽，Sg是开口的宽度， Ws是信号电路布线的线宽，Rx = {Sg /（Wg + Sg）}×100×100。

公开(公告)号：US20120008288A1

公开(公告)日：2012-01-12

申请号：US13067203

申请日：2011-05-17

申请人： Sotaro Tsukamoto ,  Eigo Inagaki

发明人： Sotaro Tsukamoto ,  Eigo Inagaki

IPC分类号： H05K1/18 ,  H05K5/00

CPC分类号： H05K9/0037 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： Disclosed herein is a module, including: a circuit board; electronic components mounted on the circuit board; a mold resin that insulates and seals the electronic components; a shield conducting film that covers the outside of the mold resin; and shield conducting walls which are so formed in the mold resin as to divide the mold resin into a plurality of regions.

摘要翻译： 这里公开了一种模块，包括：电路板; 安装在电路板上的电子元件; 绝缘和密封电子部件的模制树脂; 覆盖模制树脂外部的屏蔽导电膜; 并且屏蔽在模制树脂中形成的导电壁，以将模制树脂分成多个区域。

公开(公告)号：US07161548B2

公开(公告)日：2007-01-09

申请号：US10926315

申请日：2004-08-26

申请人： Sotaro Tsukamoto

发明人： Sotaro Tsukamoto

IPC分类号： H01Q13/03 ,  H01Q1/24

CPC分类号： H01Q1/243 ,  H01Q13/10

摘要： A wireless communication apparatus having a metal housing is provided, in which an outside antenna is not required and a small antenna the sensitivity of which does not decrease is included.A slit 1 is provided on a metal housing 5 of a wireless communication apparatus and a feeder 2 is connected to a position approximately three-quarters of the long side of the slit 1 to be used as a ⅜λ slit antenna.

摘要翻译： 提供了一种具有金属外壳的无线通信装置，其中不需要外部天线，并且包括其灵敏度不降低的小天线。 狭缝1设置在无线通信装置的金属外壳5上，馈线2连接到狭缝1的长边的大约四分之三的位置，用作3 /8λ狭缝天线。