发明申请
- 专利标题： Module Connection in a Printed Wiring Board
- 专利标题（中）： 印刷电路板中的模块连接
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申请号： US12834062申请日： 2010-07-12
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公开(公告)号： US20120009973A1公开(公告)日： 2012-01-12
- 发明人: Randolph Cary Demuynck , David Ryan Story
- 申请人： Randolph Cary Demuynck , David Ryan Story
- 申请人地址： SE Lund
- 专利权人： Sony Ericsson Mobile Communications AB
- 当前专利权人： Sony Ericsson Mobile Communications AB
- 当前专利权人地址： SE Lund
- 主分类号： H04M1/00
- IPC分类号： H04M1/00 ; H05K7/00 ; H05K3/30 ; H05K1/11
摘要：
An electronic device has a housing and circuitry disposed within the housing. The circuitry is mounted to, for example, a top surface of a Printed Wiring Board (PWB) disposed within the housing. The PWB has a dual-height cavity that is formed as a recess in the top surface. The dual-height cavity is sized to receive one or more electronic components. Electrical contacts disposed within the dual-height cavity electrically connect the electronic component to electronic circuits mounted to the top surface of the PWB.
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