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公开(公告)号：US20110014802A1
公开(公告)日：2011-01-20
申请号：US12505808
申请日：2009-07-20
IPC分类号： H01R12/00
CPC分类号： H05K7/023 , H01L23/32 , H01L23/552 , H01L25/105 , H01L2225/107 , H01L2225/1082 , H01L2924/0002 , H01L2924/09701 , H01L2924/14 , H01L2924/3025 , H05K7/1023 , H01L2924/00
摘要： The socket system comprises a set of vertically-stackable sockets. A first socket mounts on a printed circuit board to receive a first chip module, and a second socket stacks on the first socket to receive a second chip module. The first socket includes a first set of embedded contacts to electrically connect the first chip module to the printed circuit board, and a second set of embedded contacts to electrically connect the second socket to the printed circuit board. The second socket includes a third set of embedded contacts to electrically connect the second chip module to the printed circuit board. System upgrades are enabled by replacing the chip modules.
摘要翻译： 插座系统包括一组可垂直堆叠的插座。 第一插座安装在印刷电路板上以接收第一芯片模块，并且第二插座堆叠在第一插座上以接收第二芯片模块。 第一插座包括第一组嵌入式触点，用于将第一芯片模块电连接到印刷电路板;以及第二组嵌入触点，用于将第二插座电连接到印刷电路板。 第二插座包括第三组嵌入式触点，以将第二芯片模块电连接到印刷电路板。 通过更换芯片模块可实现系统升级。
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公开(公告)号：US20080171523A1
公开(公告)日：2008-07-17
申请号：US11613392
申请日：2006-12-20
CPC分类号： H03F1/0261 , H03F1/0205 , H03F1/0211 , H03F1/0233 , H03F1/0272 , H03F2200/207 , H03F2200/451 , H03F2200/465 , H03F2200/504
摘要： A power amplifier circuit for a mobile terminal controls the bias voltage depending on the modulation of the input signal. The power amplifier circuit includes a power amplifier control circuit configured to control power amplifier bias for a first input signal modulation using calibrated bias control values corresponding to a range of transmit power levels, and to control power amplifier bias for said second input signal modulation using adjusted bias control values obtained by adding bias offsets to said calibrated bias control values.
摘要翻译： 用于移动终端的功率放大器电路根据输入信号的调制来控制偏置电压。 功率放大器电路包括功率放大器控制电路，其被配置为使用对应于发射功率电平的范围的校准偏置控制值来控制用于第一输入信号调制的功率放大器偏置，并且使用经调整的调节器控制所述第二输入信号调制的功率放大器偏置 通过将偏置偏移加到所述校准的偏置控制值而获得的偏置控制值。
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公开(公告)号：US08280318B2
公开(公告)日：2012-10-02
申请号：US12542225
申请日：2009-08-17
IPC分类号： H04B1/38
CPC分类号： H04B1/38
摘要： The invention described herein provides a core modem assembly for a communication circuit that is well suited for mobile communication devices such as cellular phones, personal digital assistants, laptop computers, and hand-held computers. The core modem assembly comprises a baseband module, an RF module, and a socket connector that provides electrical isolation between the baseband module and RF module. The core modem assembly achieves a very small form factor and provides shielding between the baseband module and RF module. Further, the core modem assembly uses a “plug and play” design allowing late customization and interchangeability of the modules.
摘要翻译： 本文描述的本发明提供了一种用于通信电路的核心调制解调器组件，其非常适合于移动通信设备，例如蜂窝电话，个人数字助理，膝上型计算机和手持计算机。 核心调制解调器组件包括基带模块，RF模块和在基带模块和RF模块之间提供电隔离的插座连接器。 核心调制解调器组件实现了非常小的外形尺寸，并提供了基带模块和RF模块之间的屏蔽。 此外，核心调制解调器组件使用即插即用设计，允许模块的后期定制和可互换性。
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公开(公告)号：US20120009973A1
公开(公告)日：2012-01-12
申请号：US12834062
申请日：2010-07-12
CPC分类号： H05K1/183 , H05K1/0284 , H05K3/328 , H05K2201/09036 , H05K2201/09845 , H05K2201/10189 , Y10T29/4913
摘要： An electronic device has a housing and circuitry disposed within the housing. The circuitry is mounted to, for example, a top surface of a Printed Wiring Board (PWB) disposed within the housing. The PWB has a dual-height cavity that is formed as a recess in the top surface. The dual-height cavity is sized to receive one or more electronic components. Electrical contacts disposed within the dual-height cavity electrically connect the electronic component to electronic circuits mounted to the top surface of the PWB.
摘要翻译： 电子设备具有设置在壳体内的外壳和电路。 电路安装到例如布置在壳体内的印刷布线板（PWB）的顶表面。 PWB具有形成为顶表面中的凹部的双高度腔。 双高度腔体的尺寸适于接收一个或多个电子部件。 设置在双高度腔内的电触点将电子部件电连接到安装到PWB顶表面的电子电路。
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公开(公告)号：US07922523B2
公开(公告)日：2011-04-12
申请号：US12505808
申请日：2009-07-20
IPC分类号： H01R13/60
CPC分类号： H05K7/023 , H01L23/32 , H01L23/552 , H01L25/105 , H01L2225/107 , H01L2225/1082 , H01L2924/0002 , H01L2924/09701 , H01L2924/14 , H01L2924/3025 , H05K7/1023 , H01L2924/00
摘要： The socket system comprises a set of vertically-stackable sockets. A first socket mounts on a printed circuit board to receive a first chip module, and a second socket stacks on the first socket to receive a second chip module. The first socket includes a first set of embedded contacts to electrically connect the first chip module to the printed circuit board, and a second set of embedded contacts to electrically connect the second socket to the printed circuit board. The second socket includes a third set of embedded contacts to electrically connect the second chip module to the printed circuit board. System upgrades are enabled by replacing the chip modules.
摘要翻译： 插座系统包括一组可垂直堆叠的插座。 第一插座安装在印刷电路板上以接收第一芯片模块，并且第二插座堆叠在第一插座上以接收第二芯片模块。 第一插座包括第一组嵌入式触点，用于将第一芯片模块电连接到印刷电路板;以及第二组嵌入触点，用于将第二插座电连接到印刷电路板。 第二插座包括第三组嵌入式触点，以将第二芯片模块电连接到印刷电路板。 通过更换芯片模块可以实现系统升级。
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公开(公告)号：US20110038401A1
公开(公告)日：2011-02-17
申请号：US12542225
申请日：2009-08-17
IPC分类号： H04B1/38
CPC分类号： H04B1/38
摘要： The invention described herein provides a core modem assembly for a communication circuit that is well suited for mobile communication devices such as cellular phones, personal digital assistants, laptop computers, and hand-held computers. The core modem assembly comprises a baseband module, an RF module, and a socket connector that provides electrical isolation between the baseband module and RF module. The core modem assembly achieves a very small form factor and provides shielding between the baseband module and RF module. Further, the core modem assembly uses a “plug and play” design allowing late customization and interchangeability of the modules.
摘要翻译： 本文描述的本发明提供了一种用于通信电路的核心调制解调器组件，其非常适合于移动通信设备，例如蜂窝电话，个人数字助理，膝上型计算机和手持计算机。 核心调制解调器组件包括基带模块，RF模块和在基带模块和RF模块之间提供电隔离的插座连接器。 核心调制解调器组件实现了非常小的外形尺寸，并提供了基带模块和RF模块之间的屏蔽。 此外，核心调制解调器组件使用“即插即用”设计，允许模块的后期定制和可互换性。
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