Invention Application
- Patent Title: THERMALLY CURABLE RESIN COMPOSITION FOR PROTECTIVE FILM
- Patent Title (中): 用于保护膜的热固化树脂组合物
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Application No.: US13181142Application Date: 2011-07-12
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Publication No.: US20120010350A1Publication Date: 2012-01-12
- Inventor: Soon Chun MOK , Seung Hee LEE , Jong Hwi HWANG , Beom Su PARK , Sung Hyun KIM
- Applicant: Soon Chun MOK , Seung Hee LEE , Jong Hwi HWANG , Beom Su PARK , Sung Hyun KIM
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Priority: KR10-2010-0067078 20100712; KR10-2011-0059707 20110620
- Main IPC: C09D183/08
- IPC: C09D183/08

Abstract:
The present invention relates to a thermally curable resin composition for a protective film including an alkoxy group-containing silane-modified epoxy resin as an essential component, a protective film of a color filter prepared from the same, and a liquid crystal display device including the same. The thermally curable resin composition for a protective film of the present invention includes an alkoxy group-containing silane-modified epoxy resin as an essential component to have excellent film strength and adhesive strength, and thus may be effectively used in a protective film of a color filter for a liquid crystal display device.
Public/Granted literature
- US09000086B2 Thermally curable resin composition for protective film Public/Granted day:2015-04-07
Information query
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