发明申请
- 专利标题： METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE
- 专利标题（中）： 用于制造半导体元件的衬底的方法和半导体器件
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申请号： US13249702申请日： 2011-09-30
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公开(公告)号： US20120018860A1公开(公告)日： 2012-01-26
- 发明人: Susumu MANIWA , Takehito Tsukamoto , Junko Toda
- 申请人： Susumu MANIWA , Takehito Tsukamoto , Junko Toda
- 申请人地址： JP Tokyo
- 专利权人： TOPPAN PRINTING CO., LTD.
- 当前专利权人： TOPPAN PRINTING CO., LTD.
- 当前专利权人地址： JP Tokyo
- 优先权： JPP2009-081784 20090330
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/48
摘要：
Provided is a manufacturing method of a substrate for a semiconductor element including the steps of: providing a first photosensitive resin layer on a first surface of a metal plate; providing a second photosensitive resin layer on a second surface different from the first surface of the metal plate; forming a first etching mask for forming a connection post on the first surface of the metal plate; forming a second etching mask for forming a wiring pattern on the second surface of the metal plate; forming the connection post by performing an etching from the first surface to a midway of the metal plate; filling in a premold resin to a portion of the first surface where the connection post does not exist; processing so that a height of the connection post of the first surface is lower than a height of the premold resin surrounding the connection post; and forming the wiring pattern by performing an etching on the second surface.