发明申请
US20120018901A1 FLIP-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME USING ABLATION
审中-公开
FLIP-CHIP包装及其使用ABLATION制造相同方法
- 专利标题： FLIP-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME USING ABLATION
- 专利标题（中）： FLIP-CHIP包装及其使用ABLATION制造相同方法
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申请号： US12840937申请日： 2010-07-21
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公开(公告)号： US20120018901A1公开(公告)日： 2012-01-26
- 发明人: Patrick Variot , Qwai Low , Zafer Kutlu
- 申请人： Patrick Variot , Qwai Low , Zafer Kutlu
- 申请人地址： US PA Allentown
- 专利权人： LSI Corporation
- 当前专利权人： LSI Corporation
- 当前专利权人地址： US PA Allentown
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/60
摘要：
A method of manufacturing a flip-chip package and a flip-chip package manufactured by such method. In one embodiment, the method includes: (1) mounting a die to a first die, (2) encapsulating the second die with a molding compound and (3) selectively ablating the molding compound based on an expected heat generation of portions of the second die to reduce a thickness of the molding compound proximate the portions.
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