发明申请
- 专利标题： SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATING STRUCTURE
- 专利标题（中）： 具有热消散结构的半导体封装
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申请号： US13029124申请日： 2011-02-17
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公开(公告)号： US20120025215A1公开(公告)日： 2012-02-02
- 发明人: CHIEN-MIN CHEN , YA-WEN LIN
- 申请人： CHIEN-MIN CHEN , YA-WEN LIN
- 申请人地址： TW Hsinchu Hsien
- 专利权人： ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
- 当前专利权人： ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
- 当前专利权人地址： TW Hsinchu Hsien
- 优先权： CN201010238787.7 20100729
- 主分类号： H01L33/64
- IPC分类号： H01L33/64 ; H01L23/48 ; H01L23/34
摘要：
A semiconductor package includes a substrate, a number of electrodes formed in the substrate, a heat dissipating member fixed on the substrate, and at least one semiconductor chip mounted on the heat dissipating member and electrically connected to the electrodes. The heat dissipating member defines a receiving through hole and includes a conducting portion formed at the bottom of the receiving through hole. The at least one semiconductor chip is mounted on the conducting portion. The conducting portion efficiently conducts the heat generated by the semiconductor chip to the heat dissipating member and improves the heat dissipating efficiency of the semiconductor package.
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