发明申请
- 专利标题： SEMICONDUCTOR ENCAPSULATION AND METHOD THEREOF
- 专利标题（中）： 半导体封装及其方法
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申请号： US12846034申请日： 2010-07-29
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公开(公告)号： US20120025360A1公开(公告)日： 2012-02-02
- 发明人: Yan Xun Xue , Anup Bhalla , Jun Lu
- 申请人： Yan Xun Xue , Anup Bhalla , Jun Lu
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/60
摘要：
A semiconductor encapsulation comprises a lead frame further comprising a chip carrier and a plurality of pins in adjacent to the chip carrier. A plurality of grooves opened from an upper surface of the chip carrier partially dividing the chip carrier into a plurality of chip mounting areas. A bottom portion of the grooves is removed for completely isolate each chip mounting area, wherein a width of the bottom portion of the grooves removed is smaller than a width of the grooves. In one embodiment, a groove is located between the chip carrier and the pins with a bottom portion of the groove removed for isolate the pins from the chip carrier, wherein a width of the bottom of the grooves removed is smaller than a width of the grooves.
公开/授权文献
- US08519525B2 Semiconductor encapsulation and method thereof 公开/授权日：2013-08-27
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