Invention Application
- Patent Title: Semiconductor Device Cover Mark
- Patent Title (中): 半导体器件封面
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Application No.: US12847802Application Date: 2010-07-30
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Publication No.: US20120025368A1Publication Date: 2012-02-02
- Inventor: Yan-Fu Lin , Jing-Cheng Lin , Wen-Chih Chiou , Shin-Puu Jeng , Chen-Hua Yu
- Applicant: Yan-Fu Lin , Jing-Cheng Lin , Wen-Chih Chiou , Shin-Puu Jeng , Chen-Hua Yu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L21/56 ; H01L23/498
Abstract:
A system and method for determining underfill expansion is provided. An embodiment comprises forming cover marks along a top surface of a substrate, attaching a semiconductor substrate to the top surface of the substrate, placing an underfill material between the semiconductor substrate and the substrate, and then using the cover marks to determine the expansion of the underfill over the top surface of the substrate. Additionally, cover marks may also be formed along a top surface of the semiconductor substrate, and the cover marks on both the substrate and the semiconductor substrate may be used together as alignment marks during the alignment of the substrate and the semiconductor substrate.
Public/Granted literature
- US08629568B2 Semiconductor device cover mark Public/Granted day:2014-01-14
Information query
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