发明申请
- 专利标题： Semiconductor Device Cover Mark
- 专利标题（中）： 半导体器件封面
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申请号： US12847802申请日： 2010-07-30
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公开(公告)号： US20120025368A1公开(公告)日： 2012-02-02
- 发明人: Yan-Fu Lin , Jing-Cheng Lin , Wen-Chih Chiou , Shin-Puu Jeng , Chen-Hua Yu
- 申请人： Yan-Fu Lin , Jing-Cheng Lin , Wen-Chih Chiou , Shin-Puu Jeng , Chen-Hua Yu
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L23/544
- IPC分类号： H01L23/544 ; H01L21/56 ; H01L23/498
摘要：
A system and method for determining underfill expansion is provided. An embodiment comprises forming cover marks along a top surface of a substrate, attaching a semiconductor substrate to the top surface of the substrate, placing an underfill material between the semiconductor substrate and the substrate, and then using the cover marks to determine the expansion of the underfill over the top surface of the substrate. Additionally, cover marks may also be formed along a top surface of the semiconductor substrate, and the cover marks on both the substrate and the semiconductor substrate may be used together as alignment marks during the alignment of the substrate and the semiconductor substrate.
公开/授权文献
- US08629568B2 Semiconductor device cover mark 公开/授权日：2014-01-14
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