Invention Application
- Patent Title: Circuit Device
- Patent Title (中): 电路设备
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Application No.: US12900221Application Date: 2010-10-07
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Publication No.: US20120025898A1Publication Date: 2012-02-02
- Inventor: Tse-Peng Chen
- Applicant: Tse-Peng Chen
- Applicant Address: TW Taipei
- Assignee: RICHWAVE TECHNOLOGY CORP.
- Current Assignee: RICHWAVE TECHNOLOGY CORP.
- Current Assignee Address: TW Taipei
- Priority: TW99125307 20100730
- Main IPC: H03K17/00
- IPC: H03K17/00
Abstract:
A circuit device includes an option pad, a first power source pad, and a first ground pad, wherein the option pad, the first power source pad, and the first ground pad are formed over various portions of a top surface of the circuit device, and a function of the circuit device is determined by coupling the option pad with one of the first power source pad and the first ground pad through a wire bond.
Information query
