发明申请
- 专利标题： UPPER LAYER-FORMING COMPOSITION AND PHOTORESIST PATTERNING METHOD
- 专利标题（中）： 上层成型和光电子图案方法
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申请号： US13272501申请日： 2011-10-13
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公开(公告)号： US20120028198A1公开(公告)日： 2012-02-02
- 发明人: Atsushi NAKAMURA , Hiroki Nakagawa , Hiromitsu Nakashima , Takayuki Tsuji , Hiroshi Dougauchi , Daita Kouno , Yukio Nishimura
- 申请人： Atsushi NAKAMURA , Hiroki Nakagawa , Hiromitsu Nakashima , Takayuki Tsuji , Hiroshi Dougauchi , Daita Kouno , Yukio Nishimura
- 申请人地址： JP Tokyo
- 专利权人： JSR Corporation
- 当前专利权人： JSR Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2005-312775 20051027; JP2006-085223 20060327
- 主分类号： G03F7/20
- IPC分类号： G03F7/20 ; C08K5/06
摘要：
An upper layer-forming composition includes a resin, and a solvent. The resin is dissolvable in a developer for a photoresist film which is to be covered by the upper layer-forming composition to form a pattern by exposure to radiation. The solvent dissolves the resin in the solvent. The solvent includes a compound shown by a formula (1). Each of R1 and R2 independently represents a hydrocarbon group having 1 to 8 carbon atoms or a halogenated hydrocarbon group. R1—O—R2 (1)
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