发明申请
- 专利标题： ELECTRONIC DEVICE WITH CONNECTING STRUCTURE
- 专利标题（中）： 具有连接结构的电子设备
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申请号： US13276854申请日： 2011-10-19
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公开(公告)号： US20120032260A1公开(公告)日： 2012-02-09
- 发明人: Franz Hirler , Markus Zundel
- 申请人： Franz Hirler , Markus Zundel
- 申请人地址： AT Villach
- 专利权人： INFINEON TECHNOLOGIES AUSTRIA AG
- 当前专利权人： INFINEON TECHNOLOGIES AUSTRIA AG
- 当前专利权人地址： AT Villach
- 优先权： DE102006056809.5 20061201
- 主分类号： H01L29/78
- IPC分类号： H01L29/78 ; H01L29/41
摘要：
A semiconductor device including a connecting structure includes an edge region, a first trench and a second trench running toward the edge region, a first electrode within the first trench, and a second electrode within the second trench, the first and second electrodes being arranged in a same electrode plane with regard to a main surface of a substrate of the electronic device within the trenches, and the first electrode extending, at an edge region side end of the first trench, farther toward the edge region than the second electrode extends, at an edge region side end of the second trench, toward the edge region.
公开/授权文献
- US08698234B2 Electronic device with connecting structure 公开/授权日：2014-04-15
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