The present invention provides a multilayer printed circuit board and a method for manufacturing the same. The printed circuit board includes: an inner circuit layer which is disposed on a first insulating layer; a via land which is disposed on the first insulating layer to be spaced apart from the inner circuit layer and has a hole; a second insulating layer which is disposed on the first insulating layer including the inner circuit layer and the via land; first and second outer circuit layers which are disposed on outer surfaces of the first and second insulating layers, respectively; and a via which passes through the hole of the via land and the first and second insulating layers and electrically interconnects the first and second outer circuit layers.