Invention Application
US20120048467A1 COMPONENT TEMPERATURE CONTROL BY COOLANT FLOW CONTROL AND HEATER DUTY CYCLE CONTROL
有权
通过冷却液流量控制和加热器占空比控制的组件温度控制
- Patent Title: COMPONENT TEMPERATURE CONTROL BY COOLANT FLOW CONTROL AND HEATER DUTY CYCLE CONTROL
- Patent Title (中): 通过冷却液流量控制和加热器占空比控制的组件温度控制
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Application No.: US13040149Application Date: 2011-03-03
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Publication No.: US20120048467A1Publication Date: 2012-03-01
- Inventor: Chetan Mahadeswaraswamy , Kartik Ramaswamy , Bryan Liao , Sergio Shoji , Duy D. Nguyen , Hamid Noorbakhsh , David Palagashvili
- Applicant: Chetan Mahadeswaraswamy , Kartik Ramaswamy , Bryan Liao , Sergio Shoji , Duy D. Nguyen , Hamid Noorbakhsh , David Palagashvili
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: C23F1/08
- IPC: C23F1/08 ; F28F27/00 ; G05D7/06 ; G05D23/19 ; B05C11/00 ; C23C16/52

Abstract:
Methods and systems for controlling temperatures in plasma processing chamber for a wide range of setpoint temperatures and reduced energy consumption. Temperature control is coordinated between a coolant liquid loop and a heat source by a control algorithm implemented by the plasma processing module controller. The control algorithm may completely stop the flow of coolant liquid to a temperature-controlled component in response to a feedback signal indicating an actual temperature is below the setpoint temperature. The control algorithm may further be based at least in part on a feedforward control signal derived from a plasma power or change in plasma power input into the processing chamber during process recipe execution.
Public/Granted literature
- US08880227B2 Component temperature control by coolant flow control and heater duty cycle control Public/Granted day:2014-11-04
Information query
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