Invention Application
- Patent Title: EDDY CURRENT THICKNESS MEASUREMENT APPARATUS
- Patent Title (中): EDDY电流厚度测量装置
-
Application No.: US12862187Application Date: 2010-08-24
-
Publication No.: US20120048496A1Publication Date: 2012-03-01
- Inventor: Gary J. ROSEN , Frank SINCLAIR , Alexander SOSKOV , James S. BUFF
- Applicant: Gary J. ROSEN , Frank SINCLAIR , Alexander SOSKOV , James S. BUFF
- Applicant Address: US MA Gloucester
- Assignee: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
- Current Assignee: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
- Current Assignee Address: US MA Gloucester
- Main IPC: B22D46/00
- IPC: B22D46/00 ; B22D21/00 ; G01B7/06 ; B22D2/00
Abstract:
A sheet of a material is disposed in a melt of the material. The sheet is formed using a cooling plate in one instance. An exciting coil and sensing coil are positioned downstream of the cooling plate. The exciting coil and sensing coil use eddy currents to determine a thickness of the solid sheet on top of the melt.
Public/Granted literature
- US09057146B2 Eddy current thickness measurement apparatus Public/Granted day:2015-06-16
Information query
