发明申请
- 专利标题： HEADER CONTACT FOR AN IMPLANTABLE DEVICE
- 专利标题（中）： 用于可植入设备的头部接触
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申请号： US13207811申请日： 2011-08-11
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公开(公告)号： US20120053663A1公开(公告)日： 2012-03-01
- 发明人: Kevin P. Rodby , David A. Chizek , Lawrence D. Swanson , John M. Edgell
- 申请人： Kevin P. Rodby , David A. Chizek , Lawrence D. Swanson , John M. Edgell
- 主分类号： A61N1/05
- IPC分类号： A61N1/05 ; H01R43/20 ; H01R13/62
摘要：
An implantable medical device includes a housing, a header mounted to the housing, the header including a header body having a bore with an electrical contact located within the bore, wherein the electrical contact includes a plurality of contact points, wherein at least two of the contact points are longitudinally offset from each other along the bore.
公开/授权文献
- US08731671B2 Header contact for an implantable device 公开/授权日：2014-05-20